Name: Kingston Technology FURY 32GB 4600MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black
Brand: Kingston Technology
SKU: KF446C19RB12K2/32
Price: 165.3 GBP
Availability: InStock

Kingston Technology KCP556US8K2-32 memory module 32 GB 2 x 16 GB DDR5 5600 MHz

£129.26

RRP £175.58

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Kingston Technology FURY Beast 32GB 6000MT/s DDR5 CL36 DIMM (Kit of 2) White RGB EXPO

£142.55

RRP £188.87

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Kingston Technology FURY Beast 32GB 6000MT/s DDR5 CL40 DIMM (Kit of 2) White RGB XMP

£142.55

RRP £211.44

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Kingston Technology FURY 32GB 7200MT/s DDR5 CL38 DIMM (Kit of 2) Renegade White XMP

£214.80

RRP £297.14

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Kingston Technology FURY 32GB 7200MT/s DDR5 CL38 DIMM (Kit of 2) Renegade RGB White XMP

£224.22

RRP £319.51

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Kingston Technology FURY 32GB 4266MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black

£131.18

RRP £182.56

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Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black

£92.94

RRP £108.43

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Kingston Technology FURY 32GB 4000MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black

£118.69

RRP £145.40

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black

£92.87

RRP £134.66

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Kingston Technology FURY 32GB 4600MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black

£165.30

RRP £208.01

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Power
Memory voltage	1.1 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5

Power
Memory voltage	1.1 V
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5

Power
Memory voltage	1.35 V
Design
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	White
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	42.2 mm
Weight	90 g
Package weight	133.1 g
Packaging data
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	133.1 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.51 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	White
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	42.2 mm
Weight	90 g
Package weight	133.1 g
Packaging data
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	133.1 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.51 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	White
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	42.2 mm
Weight	90 g
Package weight	133.1 g
Packaging data
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	133.1 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.51 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

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Power
Memory voltage	1.45 V
Design
Product colour	Grey, White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Grey, White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	8
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	Grey, White
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	8
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	7.65 mm
Height	39.2 mm
Weight	97 g
Package weight	149.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	149.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.43 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.4 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	4266 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.33 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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Tracking Information