Name: Kingston Technology FURY Beast 8GB 6000MT/s DDR5 CL40 DIMM RGB
Brand: Kingston Technology
SKU: KF560C40BBA-8
Price: 47.04 GBP
Availability: OutOfStock

Kingston Technology FURY Beast 8GB 4800MT/s DDR5 CL38 DIMM Black

£39.35

RRP £50.17

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Kingston Technology FURY Beast 8GB 5200MT/s DDR5 CL40 DIMM Black

£39.35

RRP £49.18

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Kingston Technology ValueRAM KVR48U40BS6-8 memory module 8 GB 1 x 8 GB DDR5 4800 MHz

£37.64

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Kingston Technology FURY Beast 8GB 5600MT/s DDR5 CL40 DIMM Black

£39.92

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Kingston Technology FURY Beast 8GB 6000MT/s DDR5 CL40 DIMM Black

£42.00

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Kingston Technology ValueRAM KVR48S40BS6-8 memory module 8 GB 1 x 8 GB DDR5 4800 MHz

£37.64

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Kingston Technology KCP548SS6-8 memory module 8 GB 1 x 8 GB DDR5 4800 MHz

£38.36

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Kingston Technology KCP548US6-8 memory module 8 GB 1 x 8 GB DDR5 4800 MHz

£38.36

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Kingston Technology FURY Beast 8GB 4800MT/s DDR5 CL38 DIMM Black RGB

£43.60

RRP £64.30

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Kingston Technology FURY Beast 8GB 5600MT/s DDR5 CL40 DIMM RGB

£44.51

RRP £66.77

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Kingston Technology FURY Beast 8GB 5200MT/s DDR5 CL40 DIMM RGB

£43.68

RRP £64.06

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Kingston Technology FURY Beast 8GB 6000MT/s DDR5 CL40 DIMM RGB

£47.04

RRP £55.27

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Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Technical details
Sustainability certificates	RoHS
Compliance certificates	RoHS
Sustainability
Sustainability certificates	RoHS
Weight & dimensions
Width	133.3 mm
Height	31.2 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Memory Modules

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Tracking Information