Name: G.Skill Trident Z RGB F4-3200C14Q-128GTZR memory module 128 GB 4 x 32 GB DDR4 3200 MHz
Brand: G.Skill
SKU: F4-3200C14Q-128GTZR
Price: 645.77 GBP
Availability: OutOfStock

Kingston Technology FURY 128GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Beast Black

£291.43

RRP £354.58

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Kingston Technology FURY 128GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Beast RGB

£327.68

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Kingston Technology FURY 128GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black

£318.04

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Kingston Technology FURY 128GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB

£326.46

RRP £440.71

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G.Skill Trident Z RGB F4-3200C14Q-128GTZR memory module 128 GB 4 x 32 GB DDR4 3200 MHz

£645.77

RRP £866.41

Save £328.27

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Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	144.2 g
Package weight	191.9 g
Packaging data
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	191.9 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.13 kg
Products per master (outer) case	10 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	144.2 g
Package weight	191.9 g
Packaging data
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	191.9 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.13 kg
Products per master (outer) case	10 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	121.9 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	41.1 mm
Weight	155.8 g
Package weight	238.9 g
Packaging data
Package width	121.9 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	238.9 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.38 kg
Products per master (outer) case	5 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	121.9 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	41.1 mm
Weight	155.8 g
Package weight	238.9 g
Packaging data
Package width	121.9 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	238.9 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.38 kg
Products per master (outer) case	5 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

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Power
Memory voltage	1.45 V
Technical details
Country of origin	Taiwan
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
CAS latency	14
Memory voltage	1.45 V
Memory channels	Dual-channel/Quad-channel
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
CAS latency	14
Memory voltage	1.45 V
Memory channels	Dual-channel/Quad-channel
Country of origin	Taiwan
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

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Memory Modules

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Tracking Information