Name: Kingston Technology FURY 16GB 6400MT/s DDR5 CL32 DIMM Renegade RGB
Brand: Kingston Technology
SKU: KF564C32RSA-16
Price: 88.91 GBP
Availability: InStock

Kingston Technology ValueRAM KVR48U40BS8-16 memory module 16 GB 1 x 16 GB DDR5 4800 MHz

£59.60

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Kingston Technology FURY Beast 16GB 4800MT/s DDR5 CL38 DIMM Black

£57.17

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ADATA AD5U480016G-S memory module 16 GB 1 x 16 GB DDR5 4800 MHz ECC

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Kingston Technology FURY Beast 16GB 5600MT/s DDR5 CL40 DIMM Black

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Kingston Technology KCP548US8-16 memory module 16 GB 1 x 16 GB DDR5 4800 MHz

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Kingston Technology FURY Beast 16GB 4800MT/s DDR5 CL38 DIMM Black RGB

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Kingston Technology FURY Beast 16GB 5600MT/s DDR5 CL40 DIMM RGB

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Kingston Technology FURY Beast 16GB 5200MT/s DDR5 CL40 DIMM RGB

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Kingston Technology FURY Beast 16GB 6000MT/s DDR5 CL40 DIMM RGB

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Kingston Technology FURY 16GB 6400MT/s DDR5 CL32 DIMM Renegade RGB

£88.91

RRP £104.47

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Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Technical details
Country of origin	Taiwan
Sustainability certificates	RoHS
Doesn't contain	Halogen
Compliance certificates	RoHS
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Sustainability
Sustainability certificates	RoHS
Doesn't contain	Halogen
Weight & dimensions
Width	133.3 mm
Height	31.2 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Technical details
Country of origin	Taiwan
Sustainability certificates	RoHS
Doesn't contain	Halogen
Compliance certificates	RoHS
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	4800 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Sustainability
Sustainability certificates	RoHS
Doesn't contain	Halogen
Weight & dimensions
Width	133.3 mm
Height	31.2 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.1 V
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Memory
Package type	Tray
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Module configuration	2048M x 8
ECC	Yes
Memory clock speed	4800 MHz
Internal memory type	DDR5
Power
Memory voltage	1.1 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1 V
Module configuration	2048M x 8
ECC	Yes
Memory clock speed	4800 MHz
Internal memory type	DDR5
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Package type	Tray
Packaging data
Package type	Tray
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

Power
Memory voltage	1.1,1.25,1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1,1.25,1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	Black
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.1,1.25,1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	42.2 mm
Weight	45 g
Package weight	63.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	63.6 g
Logistics data
Master (outer) case width	193 mm
Master (outer) case length	325.1 mm
Master (outer) case height	88.9 mm
Master (outer) case gross weight	1.82 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.4 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	44 mm
Depth	133.3 mm
Height	7.66 mm
Weight	56.5 g
Package weight	108.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	108.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.81 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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Tracking Information