The store will not work correctly when cookies are disabled.
Memory Modules
-
![]()
| Power |
|---|
| Memory voltage | 1.35,1.5 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| Technical details |
|---|
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Intel Extreme Memory Profile (XMP) | No |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 9 |
| Memory voltage | 1.35,1.5 V |
| Memory channels | Dual-channel |
| ECC | No |
| Memory clock speed | 1600 MHz |
| Internal memory type | DDR3 |
| Features |
|---|
| Intel Extreme Memory Profile (XMP) | No |
| Backlight | No |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 9 |
| Memory voltage | 1.35,1.5 V |
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Memory channels | Dual-channel |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 1600 MHz |
| Internal memory type | DDR3 |
| Harmonized System (HS) code | 84733020 |
| System requirements |
|---|
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Width | 97.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology KF318LS11IBK2/8 memory module 8 GB 2 x 4 GB DDR3 1600 MHz | Power |
|---|
| Memory voltage | 1.35,1.5 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| Technical details |
|---|
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Intel Extreme Memory Profile (XMP) | No |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 9 |
| Memory voltage | 1.35,1.5 V |
| Memory channels | Dual-channel |
| ECC | No |
| Memory clock speed | 1600 MHz |
| Internal memory type | DDR3 |
| Features |
|---|
| Intel Extreme Memory Profile (XMP) | No |
| Backlight | No |
| Memory layout (modules x size) | 2 x 4 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 9 |
| Memory voltage | 1.35,1.5 V |
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Memory channels | Dual-channel |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 1600 MHz |
| Internal memory type | DDR3 |
| Harmonized System (HS) code | 84733020 |
| System requirements |
|---|
| Windows operating systems supported | Yes |
| Linux operating systems supported | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Width | 97.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
£52.40
£43.67 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 16GB 2666MT/s DDR4 CL16 SODIMM Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£43.68
£36.40 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 2666MT/s DDR4 CL16 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£155.88
£129.90 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL20 SODIMM Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£42.80
£35.67 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£46.20
£38.50 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 2666MT/s DDR4 CL15 SODIMM (Kit of 2) 1Gx8 Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£86.72
£72.27 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£149.18
£124.32 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£78.12
£65.10 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 8GB 3200MT/s DDR4 CL20 SODIMM Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£26.65
£22.21 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 SODIMM Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£84.16
£70.13 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 11 |
| Memory voltage | 1.35 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 44.7 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 34 ns |
| ECC | No |
| Memory clock speed | 1866 MHz |
| Internal memory type | DDR3L |
| Features |
|---|
| Product colour | Black |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 11 |
| Memory voltage | 1.35 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 44.7 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 34 ns |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 1866 MHz |
| Internal memory type | DDR3L |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Width | 67.6 mm |
| Depth | 3.8 mm |
| Height | 30 mm |
| Weight | 7.61 g |
| Package weight | 25.44 g |
| Packaging data |
|---|
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Package weight | 25.44 g |
| Logistics data |
|---|
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Impact memory module 8 GB 1 x 8 GB DDR3L 1866 MHz | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 11 |
| Memory voltage | 1.35 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 44.7 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 34 ns |
| ECC | No |
| Memory clock speed | 1866 MHz |
| Internal memory type | DDR3L |
| Features |
|---|
| Product colour | Black |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 204-pin SO-DIMM |
| CAS latency | 11 |
| Memory voltage | 1.35 V |
| Module configuration | 1024M x 64 |
| Row cycle time | 44.7 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 34 ns |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 1866 MHz |
| Internal memory type | DDR3L |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Width | 67.6 mm |
| Depth | 3.8 mm |
| Height | 30 mm |
| Weight | 7.61 g |
| Package weight | 25.44 g |
| Packaging data |
|---|
| Package width | 57.1 mm |
| Package depth | 14 mm |
| Package height | 171.4 mm |
| Package weight | 25.44 g |
| Logistics data |
|---|
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
£43.92
£36.60 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 16GB 2666MT/s DDR4 CL15 SODIMM 1Gx8 Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£46.75
£38.96 In stock
<
