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Memory Modules
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Product colour | White |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | White |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Product colour | White |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 177.8 mm |
Package depth | 14 mm |
Package height | 137.2 mm |
Width | 8.1 mm |
Depth | 133.3 mm |
Height | 45.8 mm |
Weight | 54.27 g |
Package weight | 82.35 g |
Packaging data |
---|
Package width | 177.8 mm |
Package depth | 14 mm |
Package height | 137.2 mm |
Package weight | 82.35 g |
Logistics data |
---|
Master (outer) case width | 196.9 mm |
Master (outer) case length | 235 mm |
Master (outer) case height | 152.4 mm |
Master (outer) case gross weight | 1.4 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 8GB 3600MT/s DDR4 CL17 DIMM Beast White RGB SE Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Product colour | White |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | White |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Product colour | White |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 17 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions |
---|
Package width | 177.8 mm |
Package depth | 14 mm |
Package height | 137.2 mm |
Width | 8.1 mm |
Depth | 133.3 mm |
Height | 45.8 mm |
Weight | 54.27 g |
Package weight | 82.35 g |
Packaging data |
---|
Package width | 177.8 mm |
Package depth | 14 mm |
Package height | 137.2 mm |
Package weight | 82.35 g |
Logistics data |
---|
Master (outer) case width | 196.9 mm |
Master (outer) case length | 235 mm |
Master (outer) case height | 152.4 mm |
Master (outer) case gross weight | 1.4 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£40.82
£34.02 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 8GB 3200MT/s DDR4 CL16 DIMM Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£36.41
£30.34 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£59.72
£49.77 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 4266MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£132.13
£110.11 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 4266MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£84.72
£70.60 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 4600MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.4 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 18 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£106.63
£88.86 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£98.45
£82.04 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 4000MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£119.54
£99.62 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.6 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 5333 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 5333MT/s DDR4 CL20 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.6 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 5333 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£208.04
£173.37 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£53.80
£44.83 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 8GB 4000MT/s DDR4 CL19 DIMM Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£41.68
£34.73 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£92.22
£76.85 In stock
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