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Memory | |
---|---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power | |
Memory voltage | 1.4 V |
Design | |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data | |
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Memory | |
---|---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power | |
Memory voltage | 1.4 V |
Design | |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data | |
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £62.31
Memory | |
---|---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power | |
Memory voltage | 1.4 V |
Design | |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data | |
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Memory | |
---|---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power | |
Memory voltage | 1.4 V |
Design | |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.4 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4266 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data | |
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data | |
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £49.79
Save £45.28