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| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Technical details | |
| Chips organisation | 1Rx8 |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 8 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 8 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Other features | |
| Chips organisation | 1Rx8 |
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Technical details | |
| Chips organisation | 1Rx8 |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 8 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Module configuration | 1024M x 8 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Other features | |
| Chips organisation | 1Rx8 |
Save £12.00
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | Yes |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | Yes |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Other features | |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | Yes |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | Yes |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Other features | |
| Harmonized System (HS) code | 84733020 |
Save £15.19
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Width | 8.1 mm |
| Depth | 133.3 mm |
| Height | 45.8 mm |
| Weight | 54.27 g |
| Package weight | 82.35 g |
| Packaging data | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Package weight | 82.35 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 235 mm |
| Master (outer) case height | 152.4 mm |
| Master (outer) case gross weight | 1.4 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Width | 8.1 mm |
| Depth | 133.3 mm |
| Height | 45.8 mm |
| Weight | 54.27 g |
| Package weight | 82.35 g |
| Packaging data | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Package weight | 82.35 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 235 mm |
| Master (outer) case height | 152.4 mm |
| Master (outer) case gross weight | 1.4 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £22.45
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
Save £22.96
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £17.60
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £22.23
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
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