Name: Kingston Technology ValueRAM 4GB DDR3-1600MHz memory module 1 x 4 GB
Brand: Kingston Technology
SKU: KVR16S11S8/4BK
Price: 44.93 GBP
Availability: OutOfStock

Kingston Technology ValueRAM 4GB DDR3-1600 memory module 1 x 4 GB 1600 MHz

£27.02

RRP £40.31

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Kingston Technology ValueRAM 8GB DDR3 1600MHz Module memory module 1 x 8 GB

£42.47

RRP £56.62

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Kingston Technology KF318LS11IBK2/8 memory module 8 GB 2 x 4 GB DDR3 1600 MHz

£52.07

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Kingston Technology ValueRAM 4GB DDR3-1600MHz memory module 1 x 4 GB

£44.93

RRP £58.03

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Thermaltake 27inch Flat Gaming Monitor - UK

27inch Flat Gaming Monitor - UK

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SKU : GM-GFT-27FTQB-UK
Part Number :
Manufacture : Thermaltake

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 8192 MB
Internal memory	8192 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	204
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
Memory type	PC-12800
Memory ranking	2
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
Memory type	PC-12800
Country of origin	Taiwan
Memory ranking	2
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 8192 MB
Internal memory	8192 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	204
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 8192 MB
Internal memory	8192 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	204
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
Memory type	PC-12800
Memory ranking	2
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
Memory type	PC-12800
Country of origin	Taiwan
Memory ranking	2
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 8192 MB
Internal memory	8192 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	204
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35,1.5 V
Design
Backlight	No
Cooling type	Heatsink
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	No
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	9
Memory voltage	1.35,1.5 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Intel Extreme Memory Profile (XMP)	No
Backlight	No
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	9
Memory voltage	1.35,1.5 V
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	97.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

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