Name: Kingston Technology ValueRAM 4GB DDR3 1600MHz Module memory module 1 x 4 GB DDR3L
Brand: Kingston Technology
SKU: KVR16LN11/4
Price: 27.02 GBP
Availability: InStock

Kingston Technology ValueRAM 4GB DDR3-1600 memory module 1 x 4 GB 1600 MHz

£28.04

RRP £33.65

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Kingston Technology ValueRAM 4GB DDR3-1600 memory module 1 x 4 GB 1600 MHz

£27.02

RRP £38.51

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Kingston Technology ValueRAM KVR16N11S8H/4 memory module 4 GB DDR3 1600 MHz

£27.02

RRP £37.39

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Kingston Technology ValueRAM 4GB DDR3L 1600MHz memory module 1 x 4 GB

£25.51

RRP £37.64

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Kingston Technology FURY Beast memory module 4 GB 1 x 4 GB DDR3 1600 MHz

£28.40

RRP £39.76

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Kingston Technology ValueRAM 4GB DDR3 1600MHz Module memory module 1 x 4 GB DDR3L

£27.02

RRP £34.68

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Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	133.3 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.35,1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Design
Product colour	Blue
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Blue
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	No
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	10
Memory voltage	1.5 V
Module configuration	512M x 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	37.5 ns
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	No
Product colour	Blue
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	10
Memory voltage	1.5 V
Module configuration	512M x 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	37.5 ns
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Weight & dimensions
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Width	133.3 mm
Depth	7.2 mm
Height	34 mm
Weight	36.04 g
Package weight	51.58 g
Packaging data
Package width	57.1 mm
Package depth	14 mm
Package height	171.4 mm
Package weight	51.58 g
Logistics data
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Memory
Package type	DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M x 64
Memory type	PC3-12800
Memory channels	Single-channel
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Power
Memory voltage	1.35 V
Design
Backlight	No
Product colour	Green
Cooling type	Heatsink
Technical details
Product colour	Green
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Cooling type	Heatsink
Bus clock rate	1600 MHz
Number of pins	240
Features
Buffered memory type	Unregistered (unbuffered)
Backlight	No
Product colour	Green
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M x 64
Memory type	PC3-12800
Memory channels	Single-channel
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Weight & dimensions
Width	133.3 mm
Package type	DIMM
Packaging data
Package type	DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	240
Harmonized System (HS) code	84733020

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SECURE PAYMENT

Memory Modules

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Tracking Information