Name: Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black
Brand: Kingston Technology
SKU: KF436C16RB2K2/16
Price: 62.15 GBP
Availability: InStock

Kingston Technology FURY 8GB 3600MT/s DDR4 CL17 DIMM Beast White RGB SE

£36.40

RRP £46.09

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Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black

£92.94

RRP £123.14

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Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM 1Gx8 Renegade Black

£51.19

RRP £75.94

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Kingston Technology FURY 8GB 3600MT/s DDR4 CL16 DIMM Renegade Black

£32.82

RRP £46.50

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Kingston Technology FURY 32GB 3600MT/s DDR4 CL18 DIMM Renegade Black

£88.14

RRP £118.26

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Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black

£62.15

RRP £75.61

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Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Width	8.1 mm
Depth	133.3 mm
Height	45.8 mm
Weight	54.27 g
Package weight	82.35 g
Packaging data
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Package weight	82.35 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	235 mm
Master (outer) case height	152.4 mm
Master (outer) case gross weight	1.4 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Width	8.1 mm
Depth	133.3 mm
Height	45.8 mm
Weight	54.27 g
Package weight	82.35 g
Packaging data
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Package weight	82.35 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	235 mm
Master (outer) case height	152.4 mm
Master (outer) case gross weight	1.4 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	52.67 g
Package type	Box
Package weight	104.29 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	104.29 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.75 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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