Name: Kingston Technology ValueRAM 16GB DDR3L 1600MHz Kit memory module 2 x 8 GB
Brand: Kingston Technology
SKU: KVR16LS11K2/16
Price: 84.14 GBP
Availability: InStock

Kingston Technology KF318LS11IBK2/16 memory module 16 GB 2 x 8 GB DDR3 1866 MHz

£86.38

RRP £126.68

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Kingston Technology FURY 16GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

£46.42

RRP £67.70

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Kingston Technology FURY 16GB 2666MT/s DDR4 CL15 SODIMM (Kit of 2) Impact

£46.74

RRP £56.08

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Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact

£73.01

RRP £96.73

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Kingston Technology KCP556SS6K2-16 memory module 16 GB 2 x 8 GB DDR5 5600 MHz

£79.34

RRP £95.87

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Kingston Technology ValueRAM KVR52S42BS6K2-16 memory module 16 GB 2 x 8 GB DDR5 5200 MHz

£73.01

RRP £97.95

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Kingston Technology KCP552SS6K2-16 memory module 16 GB 2 x 8 GB DDR5 5200 MHz

£76.82

RRP £110.11

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Kingston Technology ValueRAM KVR56S46BS6K2-16 memory module 16 GB 2 x 8 GB DDR5 5600 MHz

£75.23

RRP £104.69

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Kingston Technology ValueRAM 16GB DDR3L 1600MHz Kit memory module 2 x 8 GB

£84.14

RRP £125.52

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Power
Memory voltage	1.35,1.5 V
Design
Backlight	No
Cooling type	Heatsink
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	1866 MHz
Internal memory type	DDR3
Features
Intel Extreme Memory Profile (XMP)	No
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	1866 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	97.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35,1.5 V
Design
Backlight	No
Cooling type	Heatsink
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	1866 MHz
Internal memory type	DDR3
Features
Intel Extreme Memory Profile (XMP)	No
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	1866 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	97.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	15
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	15
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.1 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	29.12 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	17.77 g
Package weight	42.69 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	42.69 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.28 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35 V
Memory type	PC3-12800
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Power
Memory voltage	1.35 V
Design
Product colour	Green
Technical details
Product colour	Green
Country of origin	Taiwan
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Green
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35 V
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory type	PC3-12800
Country of origin	Taiwan
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

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Memory Modules

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Tracking Information