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| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 180 g |
| Package weight | 263.57 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 263.57 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 180 g |
| Package weight | 263.57 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 263.57 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £83.67
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 180 g |
| Package weight | 263.57 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 263.57 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 180 g |
| Package weight | 263.57 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 263.57 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £120.86
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 39.2 mm |
| Depth | 133.3 mm |
| Height | 7.65 mm |
| Weight | 97 g |
| Package weight | 149.84 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package weight | 149.84 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.43 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6400 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 39.2 mm |
| Depth | 133.3 mm |
| Height | 7.65 mm |
| Weight | 97 g |
| Package weight | 149.84 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package weight | 149.84 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.43 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £101.56
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 76.67 g |
| Package weight | 109.34 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 109.34 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 1.45 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 76.67 g |
| Package weight | 109.34 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 109.34 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 1.45 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £152.69
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.0 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 5200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 6.6 mm |
| Depth | 133.4 mm |
| Height | 34.8 mm |
| Weight | 77.1 g |
| Package weight | 101.7 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 101.7 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 2.75 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.0 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Memory data transfer rate | 5200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 6.6 mm |
| Depth | 133.4 mm |
| Height | 34.8 mm |
| Weight | 77.1 g |
| Package weight | 101.7 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 101.7 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 2.75 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £82.62
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 4800 MHz |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| SPD voltage | 1.1 V |
| SPD latency | 39 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Quad-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Power | |
| Memory voltage | 1.25 V |
| Design | |
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 4800 MHz |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| SPD voltage | 1.1 V |
| SPD latency | 39 |
| Product colour | White |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Quad-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 180 g |
| Package type | Blister |
| Package weight | 263.57 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package type | Blister |
| Package weight | 263.57 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 4800 MHz |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| SPD voltage | 1.1 V |
| SPD latency | 39 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Quad-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Power | |
| Memory voltage | 1.25 V |
| Design | |
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 4800 MHz |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| SPD voltage | 1.1 V |
| SPD latency | 39 |
| Product colour | White |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 40 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Quad-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 42.2 mm |
| Weight | 180 g |
| Package type | Blister |
| Package weight | 263.57 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package type | Blister |
| Package weight | 263.57 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £82.98
Save £45.28
