Name: Corsair Vengeance RGB Pro CMW16GX4M2E3200C16W memory module 16 GB 2 x 8 GB DDR4 3200 MHz
Brand: Corsair
SKU: CMW16GX4M2E3200C16W
Price: 72.91 GBP
Availability: OutOfStock

Kingston Technology FURY 16GB 5333MT/s DDR4 CL20 DIMM (Kit of 2) Renegade Black

£206.50

RRP £244.36

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Kingston Technology FURY 16GB 4000MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black

£65.27

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Kingston Technology FURY 16GB 4800MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black

£117.02

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Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black

£62.15

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Origin Storage 16GB DDR4 3200MHZ UDIMM 2RX8 ECC 1.2V

£75.20

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Lexar THOR memory module 16 GB 2 x 8 GB DDR4 3600 MHz

£51.84

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Origin Storage 16GB DDR4 3200MHz UDIMM 2Rx8 Non-ECC 1.2V memory module 2 x 8 GB

£37.85

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Team Group T-FORCE NIGHT HAWK RGB TF14D416G3200HC16CDC01 memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£58.58

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Team Group VULCAN FLBD516G5200HC40CDC01 memory module 16 GB 2 x 8 GB DDR5 5200 MHz

£58.68

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Corsair Vengeance RGB Pro CMW16GX4M2E3200C16W memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£72.91

RRP £90.53

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Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	20
Memory voltage	1.6 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.6 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	20
Memory voltage	1.6 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	5333 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.33 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	20
Memory voltage	1.6 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.6 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	20
Memory voltage	1.6 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	5333 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.33 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	4000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	4000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.5 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.5 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.5 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	4800 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	105.33 g
Package type	Box
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.33 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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Power
Memory voltage	1.2 V
Design
Backlight	No
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
Memory voltage	1.2 V
Memory ranking	2
ECC	Yes
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC
Memory form factor	288-pin DIMM
Memory voltage	1.2 V
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory ranking	2
ECC	Yes
Memory clock speed	3200 MHz
Internal memory type	DDR4
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-25 - 95 °C
Operating relative humidity (H-H)	10 - 80%
Storage relative humidity (H-H)	10 - 85%
Technical details
Sustainability certificates	RoHS
Compliance certificates	RoHS
Sustainability
Sustainability certificates	RoHS
Weight & dimensions
Width	133.3 mm
Depth	3.8 mm
Height	31.2 mm
Weight	100 g

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Memory Modules

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Tracking Information