Name: Goodram IRDM X memory module 16 GB 2 x 8 GB DDR4 3200 MHz
Brand: GOODRAM
SKU: IR-XW3200D464L16SA/16GDC
Price: 57.55 GBP
Availability: OutOfStock

Team Group VULCAN Z memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£69.66

RRP £89.98

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Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Renegade RGB

£70.78

RRP £94.37

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Patriot Memory Viper Steel PVSR416G320C8K memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£103.20

RRP £129.86

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G.Skill Trident Z RGB 16GB DDR4 memory module 2 x 8 GB 3200 MHz

£89.84

RRP £128.77

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Team Group DELTA RGB memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£52.09

RRP £75.98

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Team Group VULCAN Z memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£47.47

RRP £66.06

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Goodram IRDM X memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£54.94

RRP £67.75

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Goodram IRDM X memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£57.55

RRP £70.02

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Goodram IRDM X memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£57.55

RRP £74.82

Save £26.86

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Memory
Package type	Blister
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Power
Memory voltage	1.35 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Weight & dimensions
Width	7 mm
Depth	140 mm
Height	32 mm
Package type	Blister
Packaging data
Package type	Blister

Memory
Package type	Blister
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Power
Memory voltage	1.35 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Weight & dimensions
Width	7 mm
Depth	140 mm
Height	32 mm
Package type	Blister
Packaging data
Package type	Blister

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	105.33 g
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	105.33 g
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	18
Memory voltage	1.35 V
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	18
Memory voltage	1.35 V
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Technical details
Sustainability certificates	RoHS
Compliance certificates	RoHS
Sustainability
Sustainability certificates	RoHS
Weight & dimensions
Package width	179 mm
Package depth	20 mm
Package height	158 mm
Width	135 mm
Depth	7 mm
Height	44 mm
Weight	96 g
Package type	Box
Package weight	162 g
Packaging data
Package width	179 mm
Package depth	20 mm
Package height	158 mm
Package type	Box
Package weight	162 g
Logistics data
Harmonized System (HS) code	84733020
Other features
Harmonized System (HS) code	84733020

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Design
Product colour	Red
Cooling type	Heatsink
Technical details
Product colour	Red
Country of origin	Poland
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Red
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory channels	Dual-channel
Country of origin	Poland
Cooling type	Heatsink
Memory ranking	1
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Other features
Country of origin	Poland

Design
Product colour	Blue
Cooling type	Heatsink
Technical details
Product colour	Blue
Country of origin	Poland
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Blue
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory channels	Dual-channel
Country of origin	Poland
Cooling type	Heatsink
Memory ranking	1
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Other features
Country of origin	Poland

Design
Product colour	White
Cooling type	Heatsink
Technical details
Product colour	White
Country of origin	Poland
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	White
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory channels	Dual-channel
Country of origin	Poland
Cooling type	Heatsink
Memory ranking	1
ECC	No
Memory clock speed	3200 MHz
Internal memory type	DDR4
Other features
Country of origin	Poland

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