Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
Subscribe To Newsletter
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
No Minimum Spend
30 Days Return Policy
Email Support Available
Secured by SSL & 3D V2
| Design | |
|---|---|
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | White |
| Technical details | |
| Product colour | White |
| Country of origin | Taiwan |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Country of origin | Taiwan |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data | |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
| Design | |
|---|---|
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | White |
| Technical details | |
| Product colour | White |
| Country of origin | Taiwan |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Country of origin | Taiwan |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data | |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
Save £105.33
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 144.2 g |
| Package weight | 191.9 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 191.9 g |
| Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.13 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 144.2 g |
| Package weight | 191.9 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 191.9 g |
| Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.13 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Save £97.39
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 144.2 g |
| Package weight | 191.9 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 191.9 g |
| Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.13 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 144.2 g |
| Package weight | 191.9 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 191.9 g |
| Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.13 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Save £79.30
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £108.75
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £71.20
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £116.59
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 16 GB |
| Internal memory | 64 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £104.68
Save £45.28
