Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
Subscribe To Newsletter
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
No Minimum Spend
30 Days Return Policy
Email Support Available
Secured by SSL & 3D V2
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 133.3 mm |
| Depth | 3.8 mm |
| Height | 31.2 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 15.8 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory channels | Octa-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 133.3 mm |
| Depth | 3.8 mm |
| Height | 31.2 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £576.32
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £422.92
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £373.09
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £787.53
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 133.3 mm |
| Depth | 3.8 mm |
| Height | 31.2 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Row Precharge Time (TRP) | 16 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 36 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 133.3 mm |
| Depth | 3.8 mm |
| Height | 31.2 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £437.51
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.25 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £518.91
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £863.04
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £520.85
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £539.19
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.4 V |
| Design | |
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory | |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| Features | |
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability | |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data | |
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data | |
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £628.44
Save £45.28
