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Memory Modules
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| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT2K32G48C40S5 memory module 64 GB 2 x 32 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT2K8G48C40S5 memory module 16 GB 2 x 8 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT16G48C40S5 memory module 16 GB 1 x 16 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Sustainability |
|---|
| Sustainability certificates | REACH, RoHS |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT8G48C40S5 memory module 8 GB 1 x 8 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Sustainability |
|---|
| Sustainability certificates | REACH, RoHS |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Technical details |
|---|
| Chips organisation | 1Rx8 |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Chips organisation | 1Rx8 |
| Harmonized System (HS) code | 84733020 |
DELL AB949334 memory module 16 GB 1 x 16 GB DDR5 4800 MHz | Technical details |
|---|
| Chips organisation | 1Rx8 |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Chips organisation | 1Rx8 |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 8.88 g |
| Package weight | 26.72 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 26.72 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 812.13 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 16GB 4800MT/s DDR5 CL38 SODIMM Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 8.88 g |
| Package weight | 26.72 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 26.72 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 812.13 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
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| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 8.88 g |
| Package weight | 26.72 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 26.72 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 812.13 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 8.88 g |
| Package weight | 26.72 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 26.72 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 812.13 g |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Technical details |
|---|
| Chips organisation | 2Rx8 |
| Memory |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Chips organisation | 2Rx8 |
| Harmonized System (HS) code | 84733020 |
DELL AB949335 memory module 32 GB 1 x 32 GB DDR5 4800 MHz | Technical details |
|---|
| Chips organisation | 2Rx8 |
| Memory |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Chips organisation | 2Rx8 |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 6.6 mm |
| Depth | 133.4 mm |
| Height | 34.8 mm |
| Weight | 38.6 g |
| Package weight | 54.1 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 54.1 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY Beast 32GB 4800MT/s DDR5 CL38 DIMM Black | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 6.6 mm |
| Depth | 133.4 mm |
| Height | 34.8 mm |
| Weight | 38.6 g |
| Package weight | 54.1 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 54.1 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 1.5 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
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