Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
Subscribe To Newsletter
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
No Minimum Spend
30 Days Return Policy
Email Support Available
Secured by SSL & 3D V2
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 36.05 g |
| Package weight | 51.6 g |
| Packaging data | |
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 51.6 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 1.43 kg |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 36.05 g |
| Package weight | 51.6 g |
| Packaging data | |
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 51.6 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 1.43 kg |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Save £15.86
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Width | 8.1 mm |
| Depth | 133.3 mm |
| Height | 45.8 mm |
| Weight | 54.27 g |
| Package weight | 82.35 g |
| Packaging data | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Package weight | 82.35 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 235 mm |
| Master (outer) case height | 152.4 mm |
| Master (outer) case gross weight | 1.4 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Product colour | White |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | White |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Width | 8.1 mm |
| Depth | 133.3 mm |
| Height | 45.8 mm |
| Weight | 54.27 g |
| Package weight | 82.35 g |
| Packaging data | |
| Package width | 177.8 mm |
| Package depth | 14 mm |
| Package height | 137.2 mm |
| Package weight | 82.35 g |
| Logistics data | |
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 235 mm |
| Master (outer) case height | 152.4 mm |
| Master (outer) case gross weight | 1.4 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £23.13
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 63.5 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 38.8 g |
| Package weight | 57.7 g |
| Packaging data | |
| Package width | 63.5 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 57.7 g |
| Logistics data | |
| Master (outer) case width | 193 mm |
| Master (outer) case length | 325.1 mm |
| Master (outer) case height | 88.9 mm |
| Master (outer) case gross weight | 1.68 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 63.5 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 38.8 g |
| Package weight | 57.7 g |
| Packaging data | |
| Package width | 63.5 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 57.7 g |
| Logistics data | |
| Master (outer) case width | 193 mm |
| Master (outer) case length | 325.1 mm |
| Master (outer) case height | 88.9 mm |
| Master (outer) case gross weight | 1.68 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £22.10
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 52.67 g |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 52.67 g |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £15.18
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £18.61
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details | |
| Product colour | Black |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| ECC | No |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 16 mm |
| Package height | 171.4 mm |
| Width | 133.3 mm |
| Depth | 8.3 mm |
| Height | 42.4 mm |
| Weight | 64.68 g |
| Package weight | 136.32 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 16 mm |
| Package height | 171.4 mm |
| Package weight | 136.32 g |
| Logistics data | |
| Shipping (inner) case width | 19.1 cm |
| Shipping (inner) case length | 25.4 cm |
| Shipping (inner) case height | 17.8 cm |
| Products per shipping (inner) case | 15 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details | |
| Product colour | Black |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| ECC | No |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Country of origin | Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 16 mm |
| Package height | 171.4 mm |
| Width | 133.3 mm |
| Depth | 8.3 mm |
| Height | 42.4 mm |
| Weight | 64.68 g |
| Package weight | 136.32 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 16 mm |
| Package height | 171.4 mm |
| Package weight | 136.32 g |
| Logistics data | |
| Shipping (inner) case width | 19.1 cm |
| Shipping (inner) case length | 25.4 cm |
| Shipping (inner) case height | 17.8 cm |
| Products per shipping (inner) case | 15 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
Save £19.87
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| CAS latency | 18 |
| Memory voltage | 1.35 V |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Sustainability certificates | RoHS |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| CAS latency | 18 |
| Memory voltage | 1.35 V |
| Cooling type | Heatsink |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Sustainability | |
| Sustainability certificates | RoHS |
| Weight & dimensions | |
| Package width | 70 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Width | 34 mm |
| Depth | 133.3 mm |
| Height | 5.9 mm |
| Package type | Blister |
| Packaging data | |
| Package width | 70 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Package type | Blister |
| Memory | |
|---|---|
| Package type | Blister |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| CAS latency | 18 |
| Memory voltage | 1.35 V |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Cooling type | Heatsink |
| Sustainability certificates | RoHS |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| CAS latency | 18 |
| Memory voltage | 1.35 V |
| Cooling type | Heatsink |
| Memory clock speed | 3600 MHz |
| Internal memory type | DDR4 |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -20 - 65 °C |
| Sustainability | |
| Sustainability certificates | RoHS |
| Weight & dimensions | |
| Package width | 70 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Width | 34 mm |
| Depth | 133.3 mm |
| Height | 5.9 mm |
| Package type | Blister |
| Packaging data | |
| Package width | 70 mm |
| Package depth | 170 mm |
| Package height | 12.2 mm |
| Package type | Blister |
Save £16.59
| Display | |
|---|---|
| HDCP | Yes |
| Display brightness (typical) | 300 cd/m² |
| Screen shape | Flat |
| Display number of colours | 16.7 million colours |
| Native aspect ratio | 16:9 |
| Pixel density | 158 ppi |
| Colour gamut | 72% |
| Maximum refresh rate | 60 Hz |
| HD type | Full HD |
| Display technology | LCD |
| Viewing angle, horizontal | 178° |
| Viewing angle, vertical | 178° |
| Pixel pitch | 0.1611 x 0.1611 mm |
| Viewable size, horizontal | 30.9 cm |
| Viewable size, vertical | 17.4 cm |
| Digital horizontal frequency | 30 - 80 kHz |
| Digital vertical frequency | 56 - 61 Hz |
| Backlight type | LED |
| Display resolution | 1920 x 1080 pixels |
| Response time | 6 ms |
| Display diagonal | 35.6 cm (14") |
| Contrast ratio (typical) | 700:1 |
| Touchscreen | No |
| Panel type | IPS |
| RGB colour space | NTSC |
| Display diagonal (metric) | 35.56 cm |
| Anti-glare screen | Yes |
| Audio | |
| Built-in speaker(s) | No |
| Performance | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Management features | |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Multimedia | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Design | |
| Market positioning | Business |
| Heavy metals free | Hg (mercury) |
| Product colour | Grey |
| Front bezel colour | Black |
| Camera | |
| Built-in camera | No |
| Ports & interfaces | |
| Headphone out | No |
| HDCP | Yes |
| HDMI | No |
| USB Power Delivery | Yes |
| USB Power Delivery up to | 65 W |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Number of USB Type-C upstream ports quantity | 2 |
| HDCP version | 1.4 |
| Technical details | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Cable lock slot | No |
| HDMI | No |
| Product colour | Grey |
| Front bezel colour | Black |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| Power supply type | Internal |
| Weight (with stand) | 590 g |
| Touchscreen | No |
| Ergonomics | |
| VESA mounting | No |
| Cable lock slot | No |
| LED indicators | Yes |
| Tilt angle range | 10 - 90° |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Height adjustment | No |
| Tilt adjustment | Yes |
| Power | |
| Power supply type | Internal |
| Power consumption (max) | 7.5 W |
| Power consumption (standby) | 0.3 W |
| Power consumption (typical) | 5 W |
| Power consumption (off) | 0.3 W |
| Energy efficiency scale | A to G |
| Energy efficiency class (SDR) | B |
| Energy efficiency class (HDR) | Not available |
| Energy consumption (SDR) per 1000 hours | 5 kWh |
| Operational conditions | |
| Non-operating altitude | 5000 - 12192 m |
| Operating temperature (T-T) | 0 - 40 °C |
| Storage temperature (T-T) | -20 - 60 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Storage relative humidity (H-H) | 5 - 90% |
| Operating altitude | 0 - 5000 m |
| Weight & dimensions | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Width (with stand) | 322.4 mm |
| Depth (with stand) | 14.3 mm |
| Height (with stand) | 202.7 mm |
| Bezel width (side) | 6.53 mm |
| Bezel width (top) | 6.54 mm |
| Bezel width (bottom) | 2.22 cm |
| Weight (with stand) | 590 g |
| Package weight | 1.12 kg |
| Packaging data | |
| Package weight | 1.12 kg |
| Sustainability | |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| European Product Registry for Energy Labelling (EPREL) code | 1435998 |
| Total carbon footprint | 421 kg of CO2e |
| Indication | |
| LED indicators | Yes |
| Carbon footprint | |
| Total carbon footprint | 421 kg of CO2e |
| Total carbon emissions (w/o Use phase) | 374 kg of CO2e |
| Total carbon emissions (Standard deviation) | 99 kg of CO2e |
| PAIA version | 1.3.2 |
| Carbon emissions (Use) | 47 kg of CO2e |
| Carbon emissions (Manufacturing) | 368 kg of CO2e |
| Carbon emissions (Logistics) | 6 kg of CO2e |
| Carbon emissions (End-of-Life) | 1 kg of CO2e |
| Logistics data | |
| Total carbon footprint | 421 kg of CO2e |
| Other features | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Power consumption (max) | 7.5 W |
| HDMI | No |
| USB Power Delivery up to | 65 W |
| Energy efficiency scale | A to G |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Power supply type | Internal |
| Touchscreen | No |
| USB Power Delivery | Yes |
| Front bezel colour | Black |
Save £23.67
