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| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Power | |
|---|---|
| Memory voltage | 1.1 V |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
Save £33.06
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £34.58
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.4 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4266 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.4 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4266 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £48.39
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.4 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.4 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £53.82
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.6 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5333 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.6 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5333 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £89.48
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £22.84
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.5 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.5 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.5 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.5 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.5 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.5 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £74.12
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Memory | |
|---|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power | |
| Memory voltage | 1.35 V |
| Design | |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £37.29
Save £45.28
