Name: ADATA GAMMIX D35 memory module 64 GB 2 x 32 GB DDR4 3600 MHz
Brand: ADATA
SKU: AX4U360032G18I-DTBKD35
Price: 149.89 GBP
Availability: InStock

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Kingston Technology FURY 64GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) 1Gx8 Renegade RGB

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Team Group T-FORCE XTREEM ARGB memory module 64 GB 2 x 32 GB DDR4 3600 MHz

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ADATA GAMMIX D35 memory module 64 GB 2 x 32 GB DDR4 3600 MHz

£149.89

RRP £194.86

Save £69.95

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Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 16 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	18
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	18
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	105.33 g
Package weight	157.23 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	157.23 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.54 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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Memory
Package type	Tray
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC
CAS latency	18
Memory voltage	1.35 V
ECC	No
Memory clock speed	3600 MHz
Internal memory type	DDR4
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Cooling type	Heatsink
Sustainability certificates	RoHS
Compliance certificates	RoHS
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC
CAS latency	18
Memory voltage	1.35 V
Cooling type	Heatsink
ECC	No
Memory clock speed	3600 MHz
Internal memory type	DDR4
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-20 - 65 °C
Sustainability
Sustainability certificates	RoHS
Weight & dimensions
Package width	141 mm
Package depth	170 mm
Package height	12.2 mm
Width	34 mm
Depth	133.3 mm
Height	5.9 mm
Weight	29.27 g
Package type	Tray
Packaging data
Package width	141 mm
Package depth	170 mm
Package height	12.2 mm
Package type	Tray

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Memory Modules

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Tracking Information