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Items 13-21 of 21
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 144.2 g |
| Package weight | 191.9 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 191.9 g |
| Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.13 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Cooling type | Heatsink |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 113.4 mm |
| Height | 34 mm |
| Weight | 144.2 g |
| Package weight | 191.9 g |
| Packaging data | |
| Package width | 95.3 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 191.9 g |
| Logistics data | |
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 2.13 kg |
| Products per master (outer) case | 10 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Save £48.44
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 17 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £72.32
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.2 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 260 ns |
| Row active time | 29.25 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £69.24
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Width | 7.1 mm |
| Depth | 133.4 mm |
| Height | 41.1 mm |
| Weight | 155.8 g |
| Package weight | 238.9 g |
| Packaging data | |
| Package width | 121.9 mm |
| Package depth | 25.4 mm |
| Package height | 171.5 mm |
| Package weight | 238.9 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.38 kg |
| Products per master (outer) case | 5 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £41.47
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £49.77
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £62.09
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £74.74
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details | |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features | |
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions | |
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 210.67 g |
| Package weight | 313.67 g |
| Packaging data | |
| Package width | 122.2 mm |
| Package depth | 36.8 mm |
| Package height | 171.5 mm |
| Package weight | 313.67 g |
| Logistics data | |
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.38 kg |
| Products per master (outer) case | 7 pc(s) |
| Other features | |
| Country of origin | China, Taiwan |
Save £62.54
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Compatible products | Intel 300Series,Intel 400 Series,Intel 500 Series,Intel 600 Series,Intel X299,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD TRX40 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details | |
| Product colour | Black |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 2133 MHz |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| SPD voltage | 1.2 V |
| SPD latency | 15 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Compatible products | Intel 300Series,Intel 400 Series,Intel 500 Series,Intel 600 Series,Intel X299,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD TRX40 |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 2133 MHz |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| SPD voltage | 1.2 V |
| SPD latency | 15 |
| Product colour | Black |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| SPD profile | Yes |
| Cooling type | Heatsink |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Harmonized System (HS) code | 84733020 |
| Power | |
|---|---|
| Memory voltage | 1.35 V |
| Design | |
| Compatible products | Intel 300Series,Intel 400 Series,Intel 500 Series,Intel 600 Series,Intel X299,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD TRX40 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details | |
| Product colour | Black |
| Cooling type | Heatsink |
| Memory | |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 2133 MHz |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| SPD voltage | 1.2 V |
| SPD latency | 15 |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features | |
| Buffered memory type | Unregistered (unbuffered) |
| Compatible products | Intel 300Series,Intel 400 Series,Intel 500 Series,Intel 600 Series,Intel X299,AMD 300 Series,AMD 400 Series,AMD 500 Series,AMD TRX40 |
| Intel Extreme Memory Profile (XMP) | Yes |
| SPD speed | 2133 MHz |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Multicolour |
| Backlight | Yes |
| SPD voltage | 1.2 V |
| SPD latency | 15 |
| Product colour | Black |
| Memory layout (modules x size) | 4 x 8 GB |
| Internal memory | 32 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| SPD profile | Yes |
| Cooling type | Heatsink |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Other features | |
| Harmonized System (HS) code | 84733020 |
Save £158.75
Save £45.28
Items 13-21 of 21
