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Memory Modules
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| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£53.90
£44.92 In stock
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| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4266 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 4266MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4266 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£131.18
£109.32 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4266 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 4266MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4266 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£84.14
£70.12 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 4600MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 18 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£105.88
£88.23 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£92.94
£77.45 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 4000MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£118.69
£98.91 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.6 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5333 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 5333MT/s DDR4 CL20 DIMM (Kit of 2) Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.6 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 8 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 20 |
| Memory voltage | 1.6 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5333 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.33 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£206.50
£172.08 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM 1Gx8 Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£48.20
£40.17 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 8GB 4000MT/s DDR4 CL19 DIMM Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 8 GB |
| Internal memory | 8 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 19 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 1024M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 4000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£41.44
£34.53 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 105.33 g |
| Package type | Box |
| Package weight | 157.23 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 157.23 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.54 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£92.87
£77.39 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£82.48
£68.73 In stock
-
![]()
| Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM 1Gx8 Renegade Black | Memory |
|---|
| Package type | Box |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 16 GB |
| Internal memory | 16 GB |
| Component for | PC |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Width | 133.3 mm |
| Depth | 8.29 mm |
| Height | 42 mm |
| Weight | 52.67 g |
| Package type | Box |
| Package weight | 104.29 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 17.3 mm |
| Package height | 171.5 mm |
| Package type | Box |
| Package weight | 104.29 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 1.75 kg |
| Products per master (outer) case | 15 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£51.19
£42.66 In stock
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