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Memory Modules
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 2666 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 SODIMM (Kit of 2) Impact Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 16 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 2666 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£84.28
£70.23 In stock
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£78.47
£65.39 In stock
-
Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 15 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 15 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 2666 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 2666MT/s DDR4 CL15 SODIMM (Kit of 2) 1Gx8 Impact Power |
---|
Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 15 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 15 |
Memory voltage | 1.2 V |
Module configuration | 2048M x 64 |
Row cycle time | 45 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 2666 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£86.72
£72.27 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 17.77 g |
Package weight | 42.69 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 42.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.28 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 17.77 g |
Package weight | 42.69 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 42.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.28 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£110.41
£92.01 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Design |
---|
JEDEC standard | Yes |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Width | 69.6 mm |
Height | 30 mm |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
Kingston Technology ValueRAM KVR48S40BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 4800 MHz Power |
---|
Memory voltage | 1.1 V |
Design |
---|
JEDEC standard | Yes |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Width | 69.6 mm |
Height | 30 mm |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
£115.62
£96.35 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Harmonized System (HS) code | 84733020 |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
Kingston Technology KCP548SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 4800 MHz Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 4800 MHz |
Internal memory type | DDR5 |
Harmonized System (HS) code | 84733020 |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
£109.88
£91.57 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 28.56 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 28.56 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 17.77 g |
Package weight | 42.69 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 42.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.28 kg |
Products per master (outer) case | 25 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP Power |
---|
Memory voltage | 1.1 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 28.56 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 40 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 28.56 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 17.77 g |
Package weight | 42.69 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 42.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.28 kg |
Products per master (outer) case | 25 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£118.31
£98.59 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Kingston Technology KCP552SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5200 MHz Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
£117.26
£97.72 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Kingston Technology KCP556SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5600 MHz Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
£129.26
£107.72 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Technical details |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Sustainability |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Width | 69.6 mm |
Height | 30 mm |
Kingston Technology ValueRAM KVR52S42BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5200 MHz Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 42 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5200 MHz |
Internal memory type | DDR5 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Technical details |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Sustainability |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Width | 69.6 mm |
Height | 30 mm |
£117.85
£98.21 In stock
-
Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Technical details |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Sustainability |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Width | 69.6 mm |
Height | 30 mm |
Kingston Technology ValueRAM KVR56S46BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5600 MHz Power |
---|
Memory voltage | 1.1 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 46 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Technical details |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Sustainability |
---|
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions |
---|
Width | 69.6 mm |
Height | 30 mm |
£122.35
£101.96 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
SPD speed | 4800 MHz |
Intel Extreme Memory Profile (XMP) version | 3.0 |
SPD voltage | 1.1 V |
SPD latency | 39 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
SPD speed | 4800 MHz |
Intel Extreme Memory Profile (XMP) version | 3.0 |
SPD voltage | 1.1 V |
SPD latency | 39 |
Product colour | Black |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 17.77 g |
Package weight | 42.69 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 42.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.28 kg |
Products per master (outer) case | 25 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 6400MT/s DDR5 CL38 SODIMM (Kit of 2) Impact XMP Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
SPD speed | 4800 MHz |
Intel Extreme Memory Profile (XMP) version | 3.0 |
SPD voltage | 1.1 V |
SPD latency | 39 |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
SPD speed | 4800 MHz |
Intel Extreme Memory Profile (XMP) version | 3.0 |
SPD voltage | 1.1 V |
SPD latency | 39 |
Product colour | Black |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | Laptop |
Memory form factor | 262-pin SO-DIMM |
CAS latency | 38 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6400 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 17.77 g |
Package weight | 42.69 g |
Packaging data |
---|
Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 42.69 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.28 kg |
Products per master (outer) case | 25 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£151.97
£126.64 In stock
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