Name: Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Beast RGB
Brand: Kingston Technology
SKU: KF426C16BB12AK2/32
Price: 92.47 GBP
Availability: InStock

Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 SODIMM (Kit of 2) Impact

£80.62

RRP £100.10

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

£78.88

RRP £95.96

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Kingston Technology FURY 32GB 2666MT/s DDR4 CL15 SODIMM (Kit of 2) 1Gx8 Impact

£79.86

RRP £108.48

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Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 DIMM (Kit of 2) Beast Black

£81.77

RRP £97.45

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Beast Black

£79.86

RRP £111.81

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Kingston Technology FURY 32GB 3600MT/s DDR4 CL18 DIMM (Kit of 2) Beast Black

£85.20

RRP £109.35

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Beast Black

£80.60

RRP £104.79

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Kingston Technology FURY 32GB 3733MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Beast Black

£97.32

RRP £143.55

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Beast White RGB SE

£91.66

RRP £122.21

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Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Beast Black

£87.49

RRP £121.76

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Beast RGB

£96.31

RRP £129.21

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Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 DIMM (Kit of 2) 1Gx8 Beast RGB

£92.47

RRP £134.08

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Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	15
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	15
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	177.8 mm
Package depth	14 mm
Package height	190.5 mm
Width	8.1 mm
Depth	133.3 mm
Height	45.8 mm
Weight	108.53 g
Package weight	150.86 g
Packaging data
Package width	177.8 mm
Package depth	14 mm
Package height	190.5 mm
Package weight	150.86 g
Logistics data
Master (outer) case width	373.4 mm
Master (outer) case length	209.6 mm
Master (outer) case height	88.9 mm
Master (outer) case gross weight	1.68 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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Tracking Information