Name: Kingston Technology FURY Beast 8GB 2666MT/s DDR4 CL16 DIMM (Kit of 2) Black
Brand: Kingston Technology
SKU: KF426C16BBK2/8
Price: 59.16 GBP
Availability: InStock

Best Selling Product

FDL 2M CAT.6 UTP LSZH CROSSOVER CABLE- GREY

£7.09

Add to Wish List

Add to Compare

Corsair Vengeance RGB Pro memory module 32 GB 2 x 16 GB DDR4 3200 MHz

Rating:

£89.42

Add to Wish List

Add to Compare

Interquartz ENDURANCE HANDSFREE HOTELPHONE SIP WHITE

Rating:

£70.88

Add to Wish List

Add to Compare

TASSIMO COSTA AMERICANO 144G PK5X16

£21.79

Add to Wish List

Out of stock

Add to Compare

Intel Core i9-11900KF processor 3.5 GHz 16 MB Smart Cache

£200.96

Add to Wish List

Out of stock

Add to Compare

Zebra CBL-DC-382A1-01 power cable Black

Rating:

£29.30

Add to Wish List

Add to Compare

FRITZ!WLAN Stick AC 430 MU-MIMO 433 Mbit/s

Rating:

£44.35

Add to Wish List

Add to Compare

FRITZ!WLAN Stick AC 860

Rating:

£53.89

Add to Wish List

Add to Compare

Vanderbilt ACTMFCARD-B 1Kb ISO Mifare Cards - Pack of 10

Rating:

£66.38

Add to Wish List

Add to Compare

ASUS PRIME N100I-D D4 NA (integrated CPU) mini ITX

Rating:

£107.70

Add to Wish List

Add to Compare

Kingston Technology FURY 8GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Beast Black

£63.11

RRP £75.73

Save £23.14

In stock

More Info

Add to Wish List Add to Compare

Kingston Technology FURY Beast 8GB 2666MT/s DDR4 CL16 DIMM (Kit of 2) Black

£59.16

RRP £77.40

Save £28.10

In stock

More Info

Add to Wish List Add to Compare

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	72.1 g
Package weight	96.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	96.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	72.1 g
Package weight	96.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	96.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	72.1 g
Package weight	96.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	96.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	512M x 64
Row cycle time	45.75 ns
Refresh row cycle time	260 ns
Row active time	29.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	72.1 g
Package weight	96.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	96.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

FREE SHIPPING ON ALL ORDERS

MONEY BACK GUARANTEE

24/7 ONLINE SUPPORT

SECURE PAYMENT

Memory Modules

Best Selling Product

Tracking Information

Subscribe To Newsletter

FREE SHIPPING ON ALL ORDERS

MONEY BACK GUARANTEE

24/7 ONLINE SUPPORT

SECURE PAYMENT

Memory Modules

Best Selling Product

Tracking Information