Name: CoreParts MMH9691/32GB memory module 4 x 8 GB DDR3 1333 MHz ECC
Brand: CoreParts
SKU: MMH9691/32GB
Price: 223.79 GBP
Availability: InStock

Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black

£106.44

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Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) Renegade RGB

£135.90

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Kingston Technology FURY 32GB 3600MT/s DDR4 CL16 DIMM (Kit of 4) Renegade Black

£112.01

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Corsair Vengeance RGB CMG32GX4M4E3200C16 memory module 32 GB 4 x 8 GB DDR4 3200 MHz

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CoreParts MMD8791/32GB memory module 4 x 8 GB DDR3 1333 MHz ECC

£206.98

RRP £308.74

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CoreParts MMH9691/32GB memory module 4 x 8 GB DDR3 1333 MHz ECC

£223.79

RRP £315.17

Save £128.68

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Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
On-Die ECC	No
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Width	8.1 mm
Depth	133.2 mm
Height	42.9 mm
Weight	210.67 g
Package weight	313.67 g
Packaging data
Package width	122.2 mm
Package depth	36.8 mm
Package height	171.5 mm
Package weight	313.67 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.38 kg
Products per master (outer) case	7 pc(s)
Other features
Country of origin	China, Taiwan

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Memory
Package type	DIMM
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
ECC	Yes
Memory clock speed	1333 MHz
Internal memory type	DDR3
Design
Product colour	Green
Technical details
Product colour	Green
Country of origin	China
Features
Buffered memory type	Registered (buffered)
Product colour	Green
Memory layout (modules x size)	4 x 8 GB
Internal memory	32 GB
Component for	PC/Server
Country of origin	China
ECC	Yes
Memory clock speed	1333 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Weight & dimensions
Package width	145 mm
Package depth	80 mm
Package height	30 mm
Width	145 mm
Depth	80 mm
Height	30 mm
Weight	10 g
Package type	DIMM
Package weight	20 g
Packaging data
Package width	145 mm
Package depth	80 mm
Package height	30 mm
Package type	DIMM
Package weight	20 g
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	China
Harmonized System (HS) code	84733020

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Memory Modules

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Tracking Information