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Memory Modules
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.6 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 5333 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 5333MT/s DDR4 CL20 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.6 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 20 |
Memory voltage | 1.6 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 5333 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£208.04
£173.37 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3200MT/s DDR4 CL16 DIMM 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£53.80
£44.83 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM 1Gx8 Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 52.67 g |
Package type | Box |
Package weight | 104.29 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 104.29 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 1.75 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£56.92
£47.43 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 4000MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£71.24
£59.37 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.5 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.5 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.5 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 4800MT/s DDR4 CL19 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.5 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.5 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.5 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.33 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£117.85
£98.21 In stock
-
Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY 16GB 3600MT/s DDR4 CL16 DIMM (Kit of 2) Renegade Black Memory |
---|
Package type | Box |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Dual-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3600 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Width | 133.3 mm |
Depth | 8.29 mm |
Height | 42 mm |
Weight | 105.33 g |
Package type | Box |
Package weight | 157.23 g |
Packaging data |
---|
Package width | 122.2 mm |
Package depth | 17.3 mm |
Package height | 171.5 mm |
Package type | Box |
Package weight | 157.23 g |
Logistics data |
---|
Master (outer) case width | 190.5 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 177.8 mm |
Master (outer) case gross weight | 2.54 kg |
Products per master (outer) case | 15 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£62.54
£52.12 In stock
-
Design |
---|
Certification | CE, RoHS |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Weight | 28 g |
2-Power 2P-KSM32ED8/16HD memory module 16 GB 1 x 16 GB DDR4 3200 MHz ECC Design |
---|
Certification | CE, RoHS |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Weight | 28 g |
£68.21
£56.84 In stock
-
Design |
---|
Certification | CE, RoHS |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Weight | 28 g |
2-Power 2P-KSM32ES8/16ME memory module 16 GB 1 x 16 GB DDR4 3200 MHz ECC Design |
---|
Certification | CE, RoHS |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 22 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Weight | 28 g |
£68.21
£56.84 In stock
-
Design |
---|
Certification | CE, RoHS |
Memory |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
Width | 30 mm |
Depth | 130 mm |
Height | 1 mm |
Weight | 15 g |
Packaging data |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
2-Power 2P-KTD-PE426E/16G memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC Design |
---|
Certification | CE, RoHS |
Memory |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
Width | 30 mm |
Depth | 130 mm |
Height | 1 mm |
Weight | 15 g |
Packaging data |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
£57.31
£47.76 Out of stock
-
Design |
---|
Certification | CE, RoHS |
Memory |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
Width | 30 mm |
Depth | 130 mm |
Height | 1 mm |
Weight | 15 g |
Packaging data |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
2-Power 2P-KTL-TS426E/16G memory module 16 GB 1 x 16 GB DDR4 2666 MHz ECC Design |
---|
Certification | CE, RoHS |
Memory |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
CAS latency | 19 |
Certification | CE, RoHS |
ECC | Yes |
Memory clock speed | 2666 MHz |
Internal memory type | DDR4 |
Certificates |
---|
Certification | CE, RoHS |
Weight & dimensions |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
Width | 30 mm |
Depth | 130 mm |
Height | 1 mm |
Weight | 15 g |
Packaging data |
---|
Package width | 45 mm |
Package depth | 145 mm |
Package height | 5 mm |
£57.31
£47.76 Out of stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | White |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | White |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 40 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | White |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 40 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 6.6 mm |
Depth | 133.4 mm |
Height | 34.8 mm |
Weight | 38.6 g |
Package weight | 54.1 g |
Packaging data |
---|
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 54.1 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.5 kg |
Products per master (outer) case | 25 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
Kingston Technology FURY Beast 16GB 6000MT/s DDR5 CL40 DIMM White XMP Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Product colour | White |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Product colour | White |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 40 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features |
---|
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | White |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 40 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 6.6 mm |
Depth | 133.4 mm |
Height | 34.8 mm |
Weight | 38.6 g |
Package weight | 54.1 g |
Packaging data |
---|
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 54.1 g |
Logistics data |
---|
Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.5 kg |
Products per master (outer) case | 25 pc(s) |
Other features |
---|
Country of origin | China, Taiwan |
£72.94
£60.78 In stock
-
Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Cooling type | Heatsink |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Width | 6.4 mm |
Depth | 138.4 mm |
Height | 35.2 mm |
Lexar THOR memory module 16 GB 2 x 8 GB DDR4 3600 MHz Power |
---|
Memory voltage | 1.35 V |
Design |
---|
Cooling type | Heatsink |
Technical details |
---|
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 8 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 16 |
Memory voltage | 1.35 V |
Cooling type | Heatsink |
Memory clock speed | 3600 MHz |
Internal memory type | DDR4 |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
---|
Width | 6.4 mm |
Depth | 138.4 mm |
Height | 35.2 mm |
£51.85
£43.21 In stock
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