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Memory Modules
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| Power |
|---|
| Memory voltage | 1.2 V |
| Technical details |
|---|
| Country of origin | China |
| Memory |
|---|
| SPD speed | 2666 MHz |
| SPD voltage | 1.2 V |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 18 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 2666 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| SPD speed | 2666 MHz |
| SPD voltage | 1.2 V |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 18 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Country of origin | China |
| Memory clock speed | 2666 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China |
| Harmonized System (HS) code | 84733020 |
Corsair Vengeance CMSX64GX4M2A2666C18 memory module 64 GB 2 x 32 GB DDR4 2666 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Technical details |
|---|
| Country of origin | China |
| Memory |
|---|
| SPD speed | 2666 MHz |
| SPD voltage | 1.2 V |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 18 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 2666 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| SPD speed | 2666 MHz |
| SPD voltage | 1.2 V |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 18 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Country of origin | China |
| Memory clock speed | 2666 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT2K32G4SFD832A memory module 64 GB 2 x 32 GB DDR4 3200 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Lead plating | Gold |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 2666MT/s DDR4 CL16 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| Technical details |
|---|
| Cooling type | Heatsink |
| Memory |
|---|
| SPD speed | 3200 MHz |
| SPD voltage | 1.2 V |
| SPD latency | 22 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| SPD speed | 3200 MHz |
| Backlight | No |
| SPD voltage | 1.2 V |
| SPD latency | 22 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Cooling type | Heatsink |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Corsair Vengeance CMSX64GX4M2A3200C22 memory module 64 GB 2 x 32 GB DDR4 3200 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| Technical details |
|---|
| Cooling type | Heatsink |
| Memory |
|---|
| SPD speed | 3200 MHz |
| SPD voltage | 1.2 V |
| SPD latency | 22 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| SPD speed | 3200 MHz |
| Backlight | No |
| SPD voltage | 1.2 V |
| SPD latency | 22 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Cooling type | Heatsink |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Out of stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT2K32G48C40S5 memory module 64 GB 2 x 32 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
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| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| JEDEC standard | Yes |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Technical details |
|---|
| Sustainability certificates | RoHS |
| Sustainability |
|---|
| Sustainability certificates | RoHS |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Kingston Technology ValueRAM KVR48S40BD8K2-64 memory module 64 GB 2 x 32 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| JEDEC standard | Yes |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Technical details |
|---|
| Sustainability certificates | RoHS |
| Sustainability |
|---|
| Sustainability certificates | RoHS |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Kingston Technology 64GB DDR5-4800MT/S SODIMM (KIT OF 2) memory module 2 x 32 GB 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 64GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
Kingston Technology KCP556SD8K2-64 memory module 64 GB 2 x 32 GB DDR5 5600 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 42 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5200 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 42 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5200 MHz |
| Internal memory type | DDR5 |
Kingston Technology KCP552SD8K2-64 memory module 64 GB 2 x 32 GB DDR5 5200 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 42 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5200 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 32 GB |
| Internal memory | 64 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 42 |
| Memory voltage | 1.1 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 5200 MHz |
| Internal memory type | DDR5 |
In stock
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