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Memory Modules
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| Power |
|---|
| Memory voltage | 1.2 V |
| Technical details |
|---|
| Bandwidth | 19200 MB/s |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Bandwidth | 19200 MB/s |
| Harmonized System (HS) code | 84733020 |
Crucial 2x16GB DDR4 memory module 32 GB 2400 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Technical details |
|---|
| Bandwidth | 19200 MB/s |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 17 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 2400 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Bandwidth | 19200 MB/s |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Technical details |
|---|
| Country of origin | China |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China |
| Harmonized System (HS) code | 84733020 |
Corsair Vengeance CMSX32GX4M2A3200C22 memory module 32 GB 2 x 16 GB DDR4 3200 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Technical details |
|---|
| Country of origin | China |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 260-pin SO-DIMM |
| Memory voltage | 1.2 V |
| SPD profile | Yes |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 2666MT/s DDR4 CL16 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 16 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 2666MT/s DDR4 CL15 SODIMM (Kit of 2) 1Gx8 Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 15 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 2666 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Crucial CT2K16G48C40S5 memory module 32 GB 2 x 16 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Technical details |
|---|
| Sustainability certificates | REACH, RoHS |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 4800MT/s DDR5 CL38 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 38 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 29.12 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 4800 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
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| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| JEDEC standard | Yes |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Kingston Technology ValueRAM KVR48S40BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| JEDEC standard | Yes |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
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| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Compatible products | Alienware x17 R2 Gaming Laptop, Alienware m15 R7 Gaming Laptop, Dell G15 Gaming Laptop, MSI Raider GE66 12UH Gaming Laptop, MSI Raider GE66 12UHS Gaming Laptop, MSI Raider GE66 12UGS, MSI Stealth GS66 - 12U, MSI Stealth GS66 - 12UG, MSI Stealth GS66 - 12UG |
| Technical details |
|---|
| Country of origin | Taiwan |
| Memory |
|---|
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Compatible products | Alienware x17 R2 Gaming Laptop, Alienware m15 R7 Gaming Laptop, Dell G15 Gaming Laptop, MSI Raider GE66 12UH Gaming Laptop, MSI Raider GE66 12UHS Gaming Laptop, MSI Raider GE66 12UGS, MSI Stealth GS66 - 12U, MSI Stealth GS66 - 12UG, MSI Stealth GS66 - 12UG |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
Corsair VENGEANCE memory module 32 GB 2 x 16 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Compatible products | Alienware x17 R2 Gaming Laptop, Alienware m15 R7 Gaming Laptop, Dell G15 Gaming Laptop, MSI Raider GE66 12UH Gaming Laptop, MSI Raider GE66 12UHS Gaming Laptop, MSI Raider GE66 12UGS, MSI Stealth GS66 - 12U, MSI Stealth GS66 - 12UG, MSI Stealth GS66 - 12UG |
| Technical details |
|---|
| Country of origin | Taiwan |
| Memory |
|---|
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Compatible products | Alienware x17 R2 Gaming Laptop, Alienware m15 R7 Gaming Laptop, Dell G15 Gaming Laptop, MSI Raider GE66 12UH Gaming Laptop, MSI Raider GE66 12UHS Gaming Laptop, MSI Raider GE66 12UGS, MSI Stealth GS66 - 12U, MSI Stealth GS66 - 12UG, MSI Stealth GS66 - 12UG |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
In stock
-
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| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Kingston Technology KCP548SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 4800 MHz | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Memory ranking | 1 |
| ECC | No |
| Memory clock speed | 4800 MHz |
| Internal memory type | DDR5 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Technical details |
|---|
| Sustainability certificates | RoHS |
| Sustainability |
|---|
| Sustainability certificates | RoHS |
Crucial CT2K16G56C46S5 memory module 32 GB 2 x 16 GB DDR5 5600 MHz ECC | Power |
|---|
| Memory voltage | 1.1 V |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Notebook |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 46 |
| Memory voltage | 1.1 V |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Technical details |
|---|
| Sustainability certificates | RoHS |
| Sustainability |
|---|
| Sustainability certificates | RoHS |
In stock
-
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| Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP | Power |
|---|
| Memory voltage | 1.1 V |
| Design |
|---|
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 262-pin SO-DIMM |
| CAS latency | 40 |
| Memory voltage | 1.1 V |
| Lead plating | Gold |
| Module configuration | 2048M x 64 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 28.56 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 5600 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 17.77 g |
| Package weight | 42.69 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 42.69 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.28 kg |
| Products per master (outer) case | 25 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
In stock
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