Display
HDCP	Yes
Display brightness (typical)	300 cd/m²
Screen shape	Flat
Display number of colours	16.7 million colours
Native aspect ratio	16:9
Pixel density	158 ppi
Colour gamut	72%
Maximum refresh rate	60 Hz
HD type	Full HD
Display technology	LCD
Viewing angle, horizontal	178°
Viewing angle, vertical	178°
Pixel pitch	0.1611 x 0.1611 mm
Viewable size, horizontal	30.9 cm
Viewable size, vertical	17.4 cm
Digital horizontal frequency	30 - 80 kHz
Digital vertical frequency	56 - 61 Hz
Backlight type	LED
Display resolution	1920 x 1080 pixels
Response time	6 ms
Display diagonal	35.6 cm (14")
Contrast ratio (typical)	700:1
Touchscreen	No
Panel type	IPS
RGB colour space	NTSC
Display diagonal (metric)	35.56 cm
Anti-glare screen	Yes
Audio
Built-in speaker(s)	No
Performance
Built-in speaker(s)	No
Built-in camera	No
Management features
On Screen Display (OSD)	Yes
Plug and Play	Yes
Multimedia
Built-in speaker(s)	No
Built-in camera	No
Design
Market positioning	Business
Heavy metals free	Hg (mercury)
Product colour	Grey
Front bezel colour	Black
Camera
Built-in camera	No
Ports & interfaces
Headphone out	No
HDCP	Yes
HDMI	No
USB Power Delivery	Yes
USB Power Delivery up to	65 W
USB Type-C DisplayPort Alternate Mode	Yes
Number of USB Type-C upstream ports quantity	2
HDCP version	1.4
Technical details
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Cable lock slot	No
HDMI	No
Product colour	Grey
Front bezel colour	Black
Sustainability certificates	ENERGY STAR, RoHS
Doesn't contain	PVC/BFR
Power supply type	Internal
Weight (with stand)	590 g
Touchscreen	No
Ergonomics
VESA mounting	No
Cable lock slot	No
LED indicators	Yes
Tilt angle range	10 - 90°
On Screen Display (OSD)	Yes
Plug and Play	Yes
Height adjustment	No
Tilt adjustment	Yes
Power
Power supply type	Internal
Power consumption (max)	7.5 W
Power consumption (standby)	0.3 W
Power consumption (typical)	5 W
Power consumption (off)	0.3 W
Energy efficiency scale	A to G
Energy efficiency class (SDR)	B
Energy efficiency class (HDR)	Not available
Energy consumption (SDR) per 1000 hours	5 kWh
Operational conditions
Non-operating altitude	5000 - 12192 m
Operating temperature (T-T)	0 - 40 °C
Storage temperature (T-T)	-20 - 60 °C
Operating relative humidity (H-H)	10 - 80%
Storage relative humidity (H-H)	5 - 90%
Operating altitude	0 - 5000 m
Weight & dimensions
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Width (with stand)	322.4 mm
Depth (with stand)	14.3 mm
Height (with stand)	202.7 mm
Bezel width (side)	6.53 mm
Bezel width (top)	6.54 mm
Bezel width (bottom)	2.22 cm
Weight (with stand)	590 g
Package weight	1.12 kg
Packaging data
Package weight	1.12 kg
Sustainability
Sustainability certificates	ENERGY STAR, RoHS
Doesn't contain	PVC/BFR
European Product Registry for Energy Labelling (EPREL) code	1435998
Total carbon footprint	421 kg of CO2e
Indication
LED indicators	Yes
Carbon footprint
Total carbon footprint	421 kg of CO2e
Total carbon emissions (w/o Use phase)	374 kg of CO2e
Total carbon emissions (Standard deviation)	99 kg of CO2e
PAIA version	1.3.2
Carbon emissions (Use)	47 kg of CO2e
Carbon emissions (Manufacturing)	368 kg of CO2e
Carbon emissions (Logistics)	6 kg of CO2e
Carbon emissions (End-of-Life)	1 kg of CO2e
Logistics data
Total carbon footprint	421 kg of CO2e
Other features
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Power consumption (max)	7.5 W
HDMI	No
USB Power Delivery up to	65 W
Energy efficiency scale	A to G
USB Type-C DisplayPort Alternate Mode	Yes
Power supply type	Internal
Touchscreen	No
USB Power Delivery	Yes
Front bezel colour	Black

DELL P Series 14 Portable Monitor - P1424H

35.6cm (14") Full HD 1920 x 1080 LED IPS, 16:9, 300cd/m², 16.7M, 6ms, 178°/178°, 700:1

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SKU : DELL-P1424H
Part Number : 5397184821572
Manufacture : DELL

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	2133 MHz
Intel Extreme Memory Profile (XMP) version	2.0
SPD voltage	1.2 V
SPD latency	15
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
SPD profile	Yes
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	2133 MHz
Intel Extreme Memory Profile (XMP) version	2.0
SPD voltage	1.2 V
SPD latency	15
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
SPD profile	Yes
Cooling type	Heatsink
Memory clock speed	3200 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	2133 MHz
Intel Extreme Memory Profile (XMP) version	2.0
SPD voltage	1.2 V
SPD latency	15
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
SPD profile	Yes
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	2133 MHz
Intel Extreme Memory Profile (XMP) version	2.0
SPD voltage	1.2 V
SPD latency	15
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
SPD profile	Yes
Cooling type	Heatsink
Memory clock speed	3200 MHz
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	144.2 g
Package weight	191.9 g
Packaging data
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	191.9 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.13 kg
Products per master (outer) case	10 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	144.2 g
Package weight	191.9 g
Packaging data
Package width	95.3 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	191.9 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.13 kg
Products per master (outer) case	10 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Memory
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	1 x 128 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
Memory voltage	1.2 V
ECC	Yes
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Registered (buffered)
Memory layout (modules x size)	1 x 128 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
Memory voltage	1.2 V
ECC	Yes
Memory clock speed	3200 MHz
Internal memory type	DDR4

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Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	4 x 32 GB
Internal memory	128 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	121.9 mm
Package depth	25.4 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	41.1 mm
Weight	155.8 g
Package weight	238.9 g
Packaging data
Package width	121.9 mm
Package depth	25.4 mm
Package height	171.5 mm
Package weight	238.9 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.38 kg
Products per master (outer) case	5 pc(s)
Other features
Country of origin	China, Taiwan

Memory
Buffered memory type	Load reduced
Internal memory	128 GB
Memory form factor	288-pin DIMM
CAS latency	22
Memory clock speed	3200 MHz
Internal memory type	DDR4
Features
Buffered memory type	Load reduced
Internal memory	128 GB
Memory form factor	288-pin DIMM
CAS latency	22
Memory clock speed	3200 MHz
Internal memory type	DDR4

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