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Memory Modules
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| Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Internal memory | 256 GB |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | Yes |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Registered (buffered) |
| Internal memory | 256 GB |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | Yes |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
Hypertec M0T08A-HY memory module 256 GB DDR4 2133 MHz ECC | Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Internal memory | 256 GB |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | Yes |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Buffered memory type | Registered (buffered) |
| Internal memory | 256 GB |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | Yes |
| Memory clock speed | 2133 MHz |
| Internal memory type | DDR4 |
Out of stock
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| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 3200MT/s DDR4 CL16 DIMM (Kit of 8) Renegade RGB | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Out of stock
-
![]()
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 3200MT/s DDR4 CL16 DIMM (Kit of 8) Renegade Black | Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Out of stock
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