Name: Kingston Technology System Specific Memory 16GB 1600MHz memory module 2 x 8 GB DDR3L
Brand: Kingston Technology
SKU: KVR16LN11K2/16
Price: 84.14 GBP
Availability: InStock

Memory
Internal memory 0.25 GB
Memory form factor 184-pin DIMM
Internal memory type DRAM
Features
Internal memory 0.25 GB
Memory form factor 184-pin DIMM
Internal memory type DRAM
Kingston Technology System Specific Memory 256MB DDR333 memory module 0.25 GB DRAM
£40.55

Memory
Internal memory 0.25 GB
Memory form factor 184-pin DIMM
Internal memory type DRAM
Features
Internal memory 0.25 GB
Memory form factor 184-pin DIMM
Internal memory type DRAM

£40.55
£33.79
RRP £60.82
Save £27.03

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Kingston Technology ValueRAM 4GB DDR3-1600 memory module 1 x 4 GB 1600 MHz

£28.04

RRP £41.59

Save £18.23

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Kingston Technology ValueRAM 4GB DDR3-1600 memory module 1 x 4 GB 1600 MHz

£27.02

RRP £38.51

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Kingston Technology ValueRAM 8GB DDR3 1600MHz Kit memory module 2 x 4 GB

£50.40

RRP £60.06

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Kingston Technology ValueRAM KVR16N11S8H/4 memory module 4 GB DDR3 1600 MHz

£27.02

RRP £38.06

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Kingston Technology ValueRAM 4GB DDR3L 1600MHz memory module 1 x 4 GB

£25.51

RRP £30.83

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Kingston Technology ValueRAM KVR16N11/8 memory module 8 GB 1 x 8 GB DDR3 1600 MHz

£42.10

RRP £52.26

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Kingston Technology ValueRAM 16GB(2 x 8GB) DDR3-1600 memory module 2 x 8 GB 1600 MHz

£81.90

RRP £103.73

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Kingston Technology ValueRAM KVR16LS11/8 memory module 8 GB 1 x 8 GB DDR3L 1600 MHz

£41.51

RRP £48.78

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Kingston Technology ValueRAM 8GB DDR3L 1600MHz Module memory module 1 x 8 GB

£45.80

RRP £67.95

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Kingston Technology ValueRAM 2GB DDR3L memory module 1 x 2 GB 1600 MHz

£19.86

RRP £23.83

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Kingston Technology System Specific Memory 16GB 1600MHz memory module 2 x 8 GB DDR3L

£84.14

RRP £105.89

Save £35.76

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Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	SO-DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Package type	SO-DIMM
Packaging data
Package type	SO-DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M x 64
Memory type	PC3-12800
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Technical details
Memory layout	2 x 4096 MB
Internal memory	8192 MB
Chips organisation	x8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	240
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 4 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M x 64
Memory type	PC3-12800
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Weight & dimensions
Width	133.3 mm
Package type	DIMM
Packaging data
Package type	DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	2 x 4096 MB
Internal memory	8192 MB
Chips organisation	x8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Number of pins	240
Harmonized System (HS) code	84733020

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Memory
Internal memory	0.25 GB
Memory form factor	184-pin DIMM
Internal memory type	DRAM
Features
Internal memory	0.25 GB
Memory form factor	184-pin DIMM
Internal memory type	DRAM

Power
Memory voltage	1.35,1.5 V
Technical details
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 4 GB
Internal memory	4 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	512M X 64
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	67.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 4096 MB
Internal memory	4096 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Product colour	Green
Technical details
Product colour	Green
Memory layout	1 x 2048 MB
Internal memory	2048 MB
Chips organisation	X16
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 2 GB
Internal memory	2 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	256M x 64
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Green
Memory layout (modules x size)	1 x 2 GB
Internal memory	2 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	256M x 64
Country of origin	Taiwan
Memory ranking	1
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Weight & dimensions
Width	67.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	1 x 2048 MB
Internal memory	2048 MB
Chips organisation	X16
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35,1.5,1.575 V
Design
Product colour	Black, Green
Technical details
Product colour	Black, Green
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35,1.5,1.575 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1G X 64
Row cycle time	28.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Black, Green
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35,1.5,1.575 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1G X 64
Row cycle time	28.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

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FREE SHIPPING ON ALL ORDERS

MONEY BACK GUARANTEE

24/7 ONLINE SUPPORT

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Components

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Tracking Information