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Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402P |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402P |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £663.97
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7402 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.35 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Save £515.77
Processor | |
---|---|
Processor base frequency | 2.3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7352 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7352 |
Processor threads | 48 |
Processor operating modes | 32-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 7 nm |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Save £635.73
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £1,238.45
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor model | 6248R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1024 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 205 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor model | 6248R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1024 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 205 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Save £2,243.25
Processor | |
---|---|
Processor base frequency | 2.65 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7413 |
Processor threads | 48 |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 200 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.65 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 180 W |
Processor cache | 128 MB |
Processor model | 7413 |
Processor threads | 48 |
Processor boost frequency | 3.6 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 24 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 180 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 180 W |
Market segment | Server |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 180 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 200 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £589.43
Processor | |
---|---|
Processor base frequency | 2.85 GHz |
Processor manufacturer | AMD |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 200 W |
Processor cache | 128 MB |
Processor model | 7443P |
Processor threads | 48 |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 24 |
Processor socket | Socket SP3 |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 200 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 200 W |
Market segment | Server |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 200 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 200 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 2.85 GHz |
Processor manufacturer | AMD |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 200 W |
Processor cache | 128 MB |
Processor model | 7443P |
Processor threads | 48 |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 24 |
Processor socket | Socket SP3 |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 200 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 200 W |
Market segment | Server |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 200 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 200 W |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £698.69
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 230 W |
Processor cache | 36 MB |
Processor ARK ID | 215276 |
Processor model | 6342 |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 24 |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.9 GHz |
Low priority cores | 12 |
Low priority core frequency | 2.6 GHz |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 230 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 230 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 230 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215276 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 81 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 230 W |
Processor cache | 36 MB |
Processor ARK ID | 215276 |
Processor model | 6342 |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 24 |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.9 GHz |
Low priority cores | 12 |
Low priority core frequency | 2.6 GHz |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 230 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 230 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 230 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 215276 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 81 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £1,265.49
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 165 W |
Processor cache | 36 MB |
Processor model | 5318Y |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 4189 |
Processor series | Intel Xeon Gold 5000 Series |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 165 W |
Processor package size | 77.5 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 87 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 165 W |
Processor cache | 36 MB |
Processor model | 5318Y |
Processor threads | 48 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 4189 |
Processor series | Intel Xeon Gold 5000 Series |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Processor series | Intel Xeon Gold 5000 Series |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 165 W |
Processor package size | 77.5 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 87 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £603.34
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | Yes |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | Yes |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Save £1,131.97
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | No |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Processor | |
---|---|
Processor base frequency | 3.8 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Thermal Design Power (TDP) | 280 W |
Processor cache | 128 MB |
Processor model | 5965WX |
Processor threads | 48 |
Processor boost frequency | 4.5 GHz |
Processor lithography | 7 nm |
Processor family | AMD Ryzen Threadripper PRO |
Processor cores | 24 |
Box | No |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 280 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 280 W |
Market segment | Desktop |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 280 W |
PCI Express slots version | 4.0 |
Market segment | Desktop |
Save £614.21
Processor | |
---|---|
Processor generation | 13th gen Intel® Core™ i9 |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Raptor Lake |
Memory bandwidth supported by processor (max) | 89.6 GB/s |
Processor cache | 36 MB |
Processor ARK ID | 230497 |
Processor model | i9-13900KF |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 5.8 GHz |
Stepping | B0 |
Bus type | DMI4 |
Processor family | Intel® Core™ i9 |
Processor cores | 24 |
Box | Yes |
Processor socket | LGA 1700 |
Processor cache type | Smart Cache |
Performance cores | 8 |
Efficient cores | 16 |
Performance-core boost frequency | 5.4 GHz |
Performance-core base frequency | 3 GHz |
Efficient-core boost frequency | 4.3 GHz |
Efficient-core base frequency | 2.2 GHz |
Processor base power | 125 W |
Maximum turbo power | 253 W |
Maximum number of DMI lanes | 8 |
Memory | |
Maximum internal memory supported by processor | 192 GB |
Memory types supported by processor | DDR4-SDRAM, DDR5-SDRAM |
Memory bandwidth supported by processor (max) | 89.6 GB/s |
Memory channels | Dual-channel |
Memory bandwidth (max) | 89.6 GB/s |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Technical details | |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
L2 cache | 32768 KB |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'22 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 20 |
Processor ARK ID | 230497 |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | 740.17B1 |
Use conditions | PC/Client/Tablet |
Direct Media Interface (DMI) Revision | 4.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® OS Guard | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.7 GHz |
Intel® Thermal Velocity Boost Frequency | 5.8 GHz |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Intel® Thread Director | Yes |
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0 | Yes |
Intel® Standard Manageability (ISM) | Yes |
Intel® Adaptive Boost Technology | Yes |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 8542310001 |
Other features | |
Maximum internal memory | 192 GB |
L2 cache | 32768 KB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 13th gen Intel® Core™ i9 |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Raptor Lake |
Memory bandwidth supported by processor (max) | 89.6 GB/s |
Processor cache | 36 MB |
Processor ARK ID | 230497 |
Processor model | i9-13900KF |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 5.8 GHz |
Stepping | B0 |
Bus type | DMI4 |
Processor family | Intel® Core™ i9 |
Processor cores | 24 |
Box | Yes |
Processor socket | LGA 1700 |
Processor cache type | Smart Cache |
Performance cores | 8 |
Efficient cores | 16 |
Performance-core boost frequency | 5.4 GHz |
Performance-core base frequency | 3 GHz |
Efficient-core boost frequency | 4.3 GHz |
Efficient-core base frequency | 2.2 GHz |
Processor base power | 125 W |
Maximum turbo power | 253 W |
Maximum number of DMI lanes | 8 |
Memory | |
Maximum internal memory supported by processor | 192 GB |
Memory types supported by processor | DDR4-SDRAM, DDR5-SDRAM |
Memory bandwidth supported by processor (max) | 89.6 GB/s |
Memory channels | Dual-channel |
Memory bandwidth (max) | 89.6 GB/s |
Non-ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Technical details | |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
L2 cache | 32768 KB |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'22 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 20 |
Processor ARK ID | 230497 |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0, 4.0 |
PCI Express configurations | 1x16+1x4, 2x8+1x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | 740.17B1 |
Use conditions | PC/Client/Tablet |
Direct Media Interface (DMI) Revision | 4.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® OS Guard | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.7 GHz |
Intel® Thermal Velocity Boost Frequency | 5.8 GHz |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Intel® Thread Director | Yes |
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0 | Yes |
Intel® Standard Manageability (ISM) | Yes |
Intel® Adaptive Boost Technology | Yes |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 8542310001 |
Other features | |
Maximum internal memory | 192 GB |
L2 cache | 32768 KB |
CPU configuration (max) | 1 |
Save £234.44
Save £45.28