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Processor | |
---|---|
Processor base frequency | 2.75 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 225 W |
Processor cache | 64 MB |
Processor model | 7453 |
Processor threads | 56 |
Processor boost frequency | 3.45 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 28 |
Processor socket | Socket SP3 |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Thermal Design Power (TDP) | 225 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 225 W |
Market segment | Server |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 225 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 240 W |
Processor | |
---|---|
Processor base frequency | 2.75 GHz |
Processor manufacturer | AMD |
Thermal Design Power (TDP) | 225 W |
Processor cache | 64 MB |
Processor model | 7453 |
Processor threads | 56 |
Processor boost frequency | 3.45 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 28 |
Processor socket | Socket SP3 |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Thermal Design Power (TDP) | 225 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 225 W |
Market segment | Server |
Configurable TDP-up | 240 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 225 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Configurable TDP-up | 240 W |
Save £948.50
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.6 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 235 W |
Processor cache | 42 MB |
Processor ARK ID | 212456 |
Processor model | 6348 |
Processor threads | 56 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 28 |
Box | No |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.8 GHz |
Low priority cores | 16 |
Low priority core frequency | 2.5 GHz |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 235 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 235 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 235 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212456 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 80 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.6 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 235 W |
Processor cache | 42 MB |
Processor ARK ID | 212456 |
Processor model | 6348 |
Processor threads | 56 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 28 |
Box | No |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.8 GHz |
Low priority cores | 16 |
Low priority core frequency | 2.5 GHz |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 235 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 235 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 3200 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 235 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212456 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | No |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 80 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £1,140.00
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 42 MB |
Processor ARK ID | 212458 |
Processor model | 6330 |
Processor threads | 56 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.1 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 28 |
Box | No |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.1 GHz |
Low priority cores | 16 |
Low priority core frequency | 1.8 GHz |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212458 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 86 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Ice Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 42 MB |
Processor ARK ID | 212458 |
Processor model | 6330 |
Processor threads | 56 |
System bus rate | 11.2 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.1 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel® Xeon® |
Processor cores | 28 |
Box | No |
Processor socket | LGA 4189 |
High priority cores | 12 |
High priority core frequency | 2.1 GHz |
Low priority cores | 16 |
Low priority core frequency | 1.8 GHz |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q2'21 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 2933 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Target market | Cloud Computing |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 212458 |
Execute Disable Bit | Yes |
PCI Express slots version | 4.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) | G178966 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Maximum Enclave Size Support for Intel® SGX | 64 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Operational conditions | |
Tcase | 86 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 6 TB |
Save £813.51
Processor | |
---|---|
Processor generation | Intel Xeon Scalable 4th Gen |
Processor base frequency | 2 GHz |
Processor manufacturer | Intel |
Processor codename | Sapphire Rapids |
Thermal Design Power (TDP) | 205 W |
Processor cache | 52.5 MB |
Processor ARK ID | 232381 |
Processor model | 5420+ |
Processor threads | 56 |
System bus rate | 16 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.1 GHz |
Stepping | S3 |
Processor family | Intel® Xeon® Gold |
Processor cores | 28 |
Box | No |
Processor socket | LGA 4677 (Socket E) |
High priority cores | 8 |
High priority core frequency | 2.2 GHz |
Low priority cores | 20 |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR5-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0 |
Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Status | Launched |
Market segment | Server |
Launch date | Q1'23 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 4400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Package carrier | E1B |
Features | |
Maximum number of PCI Express lanes | 80 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 232381 |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0 |
Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G180729 |
Use conditions | Server/Enterprise |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® OS Guard | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Maximum Enclave Size Support for Intel® SGX | 128 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Intel® QuickAssist Software Acceleration | Yes |
Intel® On Demand Feature Activation | Yes |
Intel® QuickAssist Technology (QAT) | 1 default devices |
Intel® Dynamic Load Balancer (DLB) | 1 default devices |
Intel® Data Streaming Accelerator (DSA) | 1 default devices |
Intel® In-memory Analytics Accelerator (IAA) | 1 default devices |
Intel® Advanced Matrix Extensions (AMX) | Yes |
Operational conditions | |
Tcase | 84 °C |
DTS Max | 97 °C |
Logistics data | |
Harmonized System (HS) code | 8542310001 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 4 TB |
Processor | |
---|---|
Processor generation | Intel Xeon Scalable 4th Gen |
Processor base frequency | 2 GHz |
Processor manufacturer | Intel |
Processor codename | Sapphire Rapids |
Thermal Design Power (TDP) | 205 W |
Processor cache | 52.5 MB |
Processor ARK ID | 232381 |
Processor model | 5420+ |
Processor threads | 56 |
System bus rate | 16 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.1 GHz |
Stepping | S3 |
Processor family | Intel® Xeon® Gold |
Processor cores | 28 |
Box | No |
Processor socket | LGA 4677 (Socket E) |
High priority cores | 8 |
High priority core frequency | 2.2 GHz |
Low priority cores | 20 |
Memory | |
Maximum internal memory supported by processor | 6 TB |
Memory types supported by processor | DDR5-SDRAM |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0 |
Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 205 W |
Status | Launched |
Market segment | Server |
Launch date | Q1'23 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 3 |
Memory speed (max) | 4400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Package carrier | E1B |
Features | |
Maximum number of PCI Express lanes | 80 |
Thermal Design Power (TDP) | 205 W |
Processor package size | 77.5 x 56.5 mm |
Processor ARK ID | 232381 |
Execute Disable Bit | Yes |
PCI Express slots version | 5.0 |
Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 8542310001 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G180729 |
Use conditions | Server/Enterprise |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® OS Guard | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | Yes |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
Intel® Transactional Synchronization Extensions | Yes |
Intel® Total Memory Encryption | Yes |
Intel® Control-flow Enforcement Technology (CET) | Yes |
Maximum Enclave Size Support for Intel® SGX | 128 GB |
Intel® Platform Firmware Resilience Support | Yes |
Intel® Crypto Acceleration | Yes |
Intel® QuickAssist Software Acceleration | Yes |
Intel® On Demand Feature Activation | Yes |
Intel® QuickAssist Technology (QAT) | 1 default devices |
Intel® Dynamic Load Balancer (DLB) | 1 default devices |
Intel® Data Streaming Accelerator (DSA) | 1 default devices |
Intel® In-memory Analytics Accelerator (IAA) | 1 default devices |
Intel® Advanced Matrix Extensions (AMX) | Yes |
Operational conditions | |
Tcase | 84 °C |
DTS Max | 97 °C |
Logistics data | |
Harmonized System (HS) code | 8542310001 |
Weight & dimensions | |
Processor package size | 77.5 x 56.5 mm |
Other features | |
Maximum internal memory | 4 TB |
Save £1,183.88
Display | |
---|---|
HDCP | Yes |
Display brightness (typical) | 300 cd/m² |
Screen shape | Flat |
Display number of colours | 16.7 million colours |
Native aspect ratio | 16:9 |
Pixel density | 158 ppi |
Colour gamut | 72% |
Maximum refresh rate | 60 Hz |
HD type | Full HD |
Display technology | LCD |
Viewing angle, horizontal | 178° |
Viewing angle, vertical | 178° |
Pixel pitch | 0.1611 x 0.1611 mm |
Viewable size, horizontal | 30.9 cm |
Viewable size, vertical | 17.4 cm |
Digital horizontal frequency | 30 - 80 kHz |
Digital vertical frequency | 56 - 61 Hz |
Backlight type | LED |
Display resolution | 1920 x 1080 pixels |
Response time | 6 ms |
Display diagonal | 35.6 cm (14") |
Contrast ratio (typical) | 700:1 |
Touchscreen | No |
Panel type | IPS |
RGB colour space | NTSC |
Display diagonal (metric) | 35.56 cm |
Anti-glare screen | Yes |
Audio | |
Built-in speaker(s) | No |
Performance | |
Built-in speaker(s) | No |
Built-in camera | No |
Management features | |
On Screen Display (OSD) | Yes |
Plug and Play | Yes |
Multimedia | |
Built-in speaker(s) | No |
Built-in camera | No |
Design | |
Market positioning | Business |
Heavy metals free | Hg (mercury) |
Product colour | Grey |
Front bezel colour | Black |
Camera | |
Built-in camera | No |
Ports & interfaces | |
Headphone out | No |
HDCP | Yes |
HDMI | No |
USB Power Delivery | Yes |
USB Power Delivery up to | 65 W |
USB Type-C DisplayPort Alternate Mode | Yes |
Number of USB Type-C upstream ports quantity | 2 |
HDCP version | 1.4 |
Technical details | |
Height (without stand) | 202.7 mm |
Depth (without stand) | 4.95 mm |
Width (without stand) | 322.4 mm |
Cable lock slot | No |
HDMI | No |
Product colour | Grey |
Front bezel colour | Black |
Sustainability certificates | ENERGY STAR, RoHS |
Doesn't contain | PVC/BFR |
Power supply type | Internal |
Weight (with stand) | 590 g |
Touchscreen | No |
Ergonomics | |
VESA mounting | No |
Cable lock slot | No |
LED indicators | Yes |
Tilt angle range | 10 - 90° |
On Screen Display (OSD) | Yes |
Plug and Play | Yes |
Height adjustment | No |
Tilt adjustment | Yes |
Power | |
Power supply type | Internal |
Power consumption (max) | 7.5 W |
Power consumption (standby) | 0.3 W |
Power consumption (typical) | 5 W |
Power consumption (off) | 0.3 W |
Energy efficiency scale | A to G |
Energy efficiency class (SDR) | B |
Energy efficiency class (HDR) | Not available |
Energy consumption (SDR) per 1000 hours | 5 kWh |
Operational conditions | |
Non-operating altitude | 5000 - 12192 m |
Operating temperature (T-T) | 0 - 40 °C |
Storage temperature (T-T) | -20 - 60 °C |
Operating relative humidity (H-H) | 10 - 80% |
Storage relative humidity (H-H) | 5 - 90% |
Operating altitude | 0 - 5000 m |
Weight & dimensions | |
Height (without stand) | 202.7 mm |
Depth (without stand) | 4.95 mm |
Width (without stand) | 322.4 mm |
Width (with stand) | 322.4 mm |
Depth (with stand) | 14.3 mm |
Height (with stand) | 202.7 mm |
Bezel width (side) | 6.53 mm |
Bezel width (top) | 6.54 mm |
Bezel width (bottom) | 2.22 cm |
Weight (with stand) | 590 g |
Package weight | 1.12 kg |
Packaging data | |
Package weight | 1.12 kg |
Sustainability | |
Sustainability certificates | ENERGY STAR, RoHS |
Doesn't contain | PVC/BFR |
European Product Registry for Energy Labelling (EPREL) code | 1435998 |
Total carbon footprint | 421 kg of CO2e |
Indication | |
LED indicators | Yes |
Carbon footprint | |
Total carbon footprint | 421 kg of CO2e |
Total carbon emissions (w/o Use phase) | 374 kg of CO2e |
Total carbon emissions (Standard deviation) | 99 kg of CO2e |
PAIA version | 1.3.2 |
Carbon emissions (Use) | 47 kg of CO2e |
Carbon emissions (Manufacturing) | 368 kg of CO2e |
Carbon emissions (Logistics) | 6 kg of CO2e |
Carbon emissions (End-of-Life) | 1 kg of CO2e |
Logistics data | |
Total carbon footprint | 421 kg of CO2e |
Other features | |
Height (without stand) | 202.7 mm |
Depth (without stand) | 4.95 mm |
Width (without stand) | 322.4 mm |
Power consumption (max) | 7.5 W |
HDMI | No |
USB Power Delivery up to | 65 W |
Energy efficiency scale | A to G |
USB Type-C DisplayPort Alternate Mode | Yes |
Power supply type | Internal |
Touchscreen | No |
USB Power Delivery | Yes |
Front bezel colour | Black |
Save £23.67