Processor
Processor base frequency	2.65 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	8324P
Processor threads	64
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	32
Box	No
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	180 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W

Processor
Processor base frequency	2.05 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	130 W
Processor cache	128 MB
Processor model	8324PN
Processor threads	64
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	32
Box	No
Processor socket	Socket SP6
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	130 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	130 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	130 W
PCI Express slots version	5.0
Market segment	Server

Processor
Processor base frequency	2.3 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	8534P
Processor threads	128
Processor boost frequency	3.1 GHz
Processor family	AMD EPYC
Processor cores	64
Box	No
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	200 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W

Processor
Processor base frequency	2.5 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	8434P
Processor threads	96
Processor boost frequency	3.1 GHz
Processor family	AMD EPYC
Processor cores	48
Box	No
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	200 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W

Processor
Processor base frequency	2.45 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	120 W
Thermal Design Power (TDP)	125 W
Processor cache	64 MB
Processor model	8124P
Processor threads	32
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	16
Box	No
Processor socket	Socket SP6
Configurable TDP-up	150 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	120 W
Thermal Design Power (TDP)	125 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	125 W
Market segment	Server
Configurable TDP-up	150 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	125 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	150 W

Processor
Processor base frequency	2.55 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	160 W
Processor cache	64 MB
Processor model	8224P
Processor threads	48
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	160 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	160 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	160 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	70 W
Thermal Design Power (TDP)	90 W
Processor cache	32 MB
Processor model	8024P
Processor threads	16
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	8
Box	No
Processor socket	Socket SP6
Configurable TDP-up	100 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	70 W
Thermal Design Power (TDP)	90 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	90 W
Market segment	Server
Configurable TDP-up	100 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	90 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	100 W

Processors

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