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| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 22 MB |
| Processor ARK ID | 193394 |
| Processor model | 4216 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 100 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2400 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 193394 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | No |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | No |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 79 °C |
| Packaging data | |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Other features | |
| Maximum internal memory | 1 TB |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 22 MB |
| Processor ARK ID | 193394 |
| Processor model | 4216 |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 100 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2400 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 193394 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | No |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | No |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 79 °C |
| Packaging data | |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Other features | |
| Maximum internal memory | 1 TB |
Save £315.27
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 22 MB |
| Processor ARK ID | 193753 |
| Processor model | W-3245 |
| Processor threads | 32 |
| System bus rate | 8 GT/s |
| Processor boost frequency | 4.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon W |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 193753 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | No |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | No |
| Intel Speed Select Technology (SST) | No |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.6 GHz |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Other features | |
| Maximum internal memory | 1 TB |
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 22 MB |
| Processor ARK ID | 193753 |
| Processor model | W-3245 |
| Processor threads | 32 |
| System bus rate | 8 GT/s |
| Processor boost frequency | 4.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon W |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 193753 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | No |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | No |
| Intel Speed Select Technology (SST) | No |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.6 GHz |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Other features | |
| Maximum internal memory | 1 TB |
Save £1,084.41
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302 |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302 |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £459.74
| Processor | |
|---|---|
| Processor base frequency | 2.8 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 120 W |
| Processor cache | 64 MB |
| Processor model | 7282 |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 85.3 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 120 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 120 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 120 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 2.8 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 120 W |
| Processor cache | 64 MB |
| Processor model | 7282 |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 85.3 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 120 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 120 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 120 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £356.44
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302P |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7302P |
| Processor threads | 32 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £315.26
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor ARK ID | 199353 |
| Processor model | 6246R |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'20 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 199353 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 75 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Other features | |
| Maximum internal memory | 1 TB |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor ARK ID | 199353 |
| Processor model | 6246R |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'20 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 199353 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 75 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Other features | |
| Maximum internal memory | 1 TB |
Save £1,360.87
| Processor | |
|---|---|
| Processor base frequency | 3.4 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 105 W |
| Processor cache | 64 MB |
| Processor model | 5950X |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.9 GHz |
| Component for | PC |
| Processor lithography | 7 nm |
| Processor family | AMD Ryzen™ 9 |
| Processor cores | 16 |
| Box | Yes |
| Processor socket | Socket AM4 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Non-ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 105 W |
| Technical details | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 105 W |
| Market segment | Desktop |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 105 W |
| PCI Express slots version | 4.0 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3.4 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 105 W |
| Processor cache | 64 MB |
| Processor model | 5950X |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.9 GHz |
| Component for | PC |
| Processor lithography | 7 nm |
| Processor family | AMD Ryzen™ 9 |
| Processor cores | 16 |
| Box | Yes |
| Processor socket | Socket AM4 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Non-ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 105 W |
| Technical details | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 105 W |
| Market segment | Desktop |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 105 W |
| PCI Express slots version | 4.0 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £149.11
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Processor cache | 128 MB |
| Processor model | 7343 |
| Processor threads | 32 |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 190 W |
| Market segment | Server |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 190 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 200 W |
| Processor | |
|---|---|
| Processor base frequency | 3.2 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Processor cache | 128 MB |
| Processor model | 7343 |
| Processor threads | 32 |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 190 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 190 W |
| Market segment | Server |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 190 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 200 W |
Save £339.41
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313 |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313 |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £230.02
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313P |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313P |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £435.31
| Processor | |
|---|---|
| Processor base frequency | 3.5 GHz |
| Processor manufacturer | AMD |
| Thermal Design Power (TDP) | 240 W |
| Processor cache | 256 MB |
| Processor model | 73F3 |
| Processor threads | 32 |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Thermal Design Power (TDP) | 240 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 240 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 240 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3.5 GHz |
| Processor manufacturer | AMD |
| Thermal Design Power (TDP) | 240 W |
| Processor cache | 256 MB |
| Processor model | 73F3 |
| Processor threads | 32 |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Power | |
| Thermal Design Power (TDP) | 240 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 240 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 240 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
Save £843.03
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 36 MB |
| Processor ARK ID | 212457 |
| Processor model | 6346 |
| Processor threads | 32 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 4 |
| High priority core frequency | 3.2 GHz |
| Low priority cores | 12 |
| Low priority core frequency | 3 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212457 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 78 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 36 MB |
| Processor ARK ID | 212457 |
| Processor model | 6346 |
| Processor threads | 32 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 4 |
| High priority core frequency | 3.2 GHz |
| Low priority cores | 12 |
| Low priority core frequency | 3 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212457 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 78 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £1,086.17
| Display | |
|---|---|
| HDCP | Yes |
| Display brightness (typical) | 300 cd/m² |
| Screen shape | Flat |
| Display number of colours | 16.7 million colours |
| Native aspect ratio | 16:9 |
| Pixel density | 158 ppi |
| Colour gamut | 72% |
| Maximum refresh rate | 60 Hz |
| HD type | Full HD |
| Display technology | LCD |
| Viewing angle, horizontal | 178° |
| Viewing angle, vertical | 178° |
| Pixel pitch | 0.1611 x 0.1611 mm |
| Viewable size, horizontal | 30.9 cm |
| Viewable size, vertical | 17.4 cm |
| Digital horizontal frequency | 30 - 80 kHz |
| Digital vertical frequency | 56 - 61 Hz |
| Backlight type | LED |
| Display resolution | 1920 x 1080 pixels |
| Response time | 6 ms |
| Display diagonal | 35.6 cm (14") |
| Contrast ratio (typical) | 700:1 |
| Touchscreen | No |
| Panel type | IPS |
| RGB colour space | NTSC |
| Display diagonal (metric) | 35.56 cm |
| Anti-glare screen | Yes |
| Audio | |
| Built-in speaker(s) | No |
| Performance | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Management features | |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Multimedia | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Design | |
| Market positioning | Business |
| Heavy metals free | Hg (mercury) |
| Product colour | Grey |
| Front bezel colour | Black |
| Camera | |
| Built-in camera | No |
| Ports & interfaces | |
| Headphone out | No |
| HDCP | Yes |
| HDMI | No |
| USB Power Delivery | Yes |
| USB Power Delivery up to | 65 W |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Number of USB Type-C upstream ports quantity | 2 |
| HDCP version | 1.4 |
| Technical details | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Cable lock slot | No |
| HDMI | No |
| Product colour | Grey |
| Front bezel colour | Black |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| Power supply type | Internal |
| Weight (with stand) | 590 g |
| Touchscreen | No |
| Ergonomics | |
| VESA mounting | No |
| Cable lock slot | No |
| LED indicators | Yes |
| Tilt angle range | 10 - 90° |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Height adjustment | No |
| Tilt adjustment | Yes |
| Power | |
| Power supply type | Internal |
| Power consumption (max) | 7.5 W |
| Power consumption (standby) | 0.3 W |
| Power consumption (typical) | 5 W |
| Power consumption (off) | 0.3 W |
| Energy efficiency scale | A to G |
| Energy efficiency class (SDR) | B |
| Energy efficiency class (HDR) | Not available |
| Energy consumption (SDR) per 1000 hours | 5 kWh |
| Operational conditions | |
| Non-operating altitude | 5000 - 12192 m |
| Operating temperature (T-T) | 0 - 40 °C |
| Storage temperature (T-T) | -20 - 60 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Storage relative humidity (H-H) | 5 - 90% |
| Operating altitude | 0 - 5000 m |
| Weight & dimensions | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Width (with stand) | 322.4 mm |
| Depth (with stand) | 14.3 mm |
| Height (with stand) | 202.7 mm |
| Bezel width (side) | 6.53 mm |
| Bezel width (top) | 6.54 mm |
| Bezel width (bottom) | 2.22 cm |
| Weight (with stand) | 590 g |
| Package weight | 1.12 kg |
| Packaging data | |
| Package weight | 1.12 kg |
| Sustainability | |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| European Product Registry for Energy Labelling (EPREL) code | 1435998 |
| Total carbon footprint | 421 kg of CO2e |
| Indication | |
| LED indicators | Yes |
| Carbon footprint | |
| Total carbon footprint | 421 kg of CO2e |
| Total carbon emissions (w/o Use phase) | 374 kg of CO2e |
| Total carbon emissions (Standard deviation) | 99 kg of CO2e |
| PAIA version | 1.3.2 |
| Carbon emissions (Use) | 47 kg of CO2e |
| Carbon emissions (Manufacturing) | 368 kg of CO2e |
| Carbon emissions (Logistics) | 6 kg of CO2e |
| Carbon emissions (End-of-Life) | 1 kg of CO2e |
| Logistics data | |
| Total carbon footprint | 421 kg of CO2e |
| Other features | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Power consumption (max) | 7.5 W |
| HDMI | No |
| USB Power Delivery up to | 65 W |
| Energy efficiency scale | A to G |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Power supply type | Internal |
| Touchscreen | No |
| USB Power Delivery | Yes |
| Front bezel colour | Black |
Save £26.43
