Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7402P
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.3 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7352
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.65 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	165 W
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7413
Processor threads	48
Processor boost frequency	3.6 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Configurable TDP-up	200 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Configurable TDP-up	200 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	200 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.85 GHz
Processor manufacturer	AMD
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7443P
Processor threads	48
Processor boost frequency	4 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Configurable TDP-up	200 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	200 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	200 W
Logistics data
Harmonized System (HS) code	85423119

Processors