Processor
Processor base frequency	3.7 GHz
Processor manufacturer	AMD
Cooler included	Yes
Thermal Design Power (TDP)	65 W
Processor cache	4 MB
Processor model	3400G
Processor threads	8
Processor operating modes	64-bit
Component for	PC
Processor lithography	12 nm
Processor family	AMD Ryzen™ 5
Processor cores	4
Box	Yes
Processor socket	Socket AM4
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2933 MHz
Memory channels	Dual-channel
Graphics
Discrete graphics card	No
On-board graphics card model	AMD Radeon RX Vega 11
On-board graphics card	Yes
On-board graphics card dynamic frequency (max)	1400 MHz
Power
Thermal Design Power (TDP)	65 W
Features
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Technical details
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Processor cache type	L3

Processor
Processor base frequency	3.6 GHz
Processor manufacturer	AMD
Cooler included	Yes
Thermal Design Power (TDP)	65 W
Processor cache	32 MB
Processor model	3600
Processor threads	12
Processor operating modes	64-bit
Component for	PC
Processor lithography	7 nm
Processor family	AMD Ryzen™ 5
Processor cores	6
Processor socket	Socket AM4
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Dual-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	65 W
Technical details
PCI Express configurations	1x16
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Processor cache type	L3
Features
Thermal Design Power (TDP)	65 W
PCI Express configurations	1x16
Market segment	Desktop
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3.9 GHz
Processor manufacturer	AMD
Cooler included	Yes
Configurable TDP-down	45 W
Thermal Design Power (TDP)	65 W
Processor cache	16 MB
Processor model	5600G
Processor threads	12
Processor operating modes	64-bit
Processor boost frequency	4.4 GHz
Component for	PC
Processor lithography	7 nm
Processor family	AMD Ryzen™ 5
Processor cores	6
Box	Yes
Processor socket	Socket AM4
Configurable TDP-up	65 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Dual-channel
Non-ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	AMD Radeon Graphics
On-board graphics card	Yes
On-board graphics card base frequency	1900 MHz
Discrete graphics card model	Not available
Power
Configurable TDP-down	45 W
Thermal Design Power (TDP)	65 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)	No
PCI Express slots version	3.0
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Configurable TDP-up	65 W
Processor cache type	L3
Features
Thermal Design Power (TDP)	65 W
PCI Express slots version	3.0
Market segment	Desktop
Harmonized System (HS) code	85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Configurable TDP-up	65 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3.5 GHz
Processor manufacturer	AMD
Cooler included	Yes
Thermal Design Power (TDP)	65 W
Processor cache	32 MB
Processor model	5600
Processor threads	12
Processor operating modes	64-bit
Processor boost frequency	4.4 GHz
Processor lithography	7 nm
Processor family	AMD Ryzen™ 5
Processor cores	6
Box	Yes
Processor socket	Socket AM4
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2667,2933,3200 MHz
Memory channels	Dual-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	65 W
Technical details
Intel® Hyper Threading Technology (Intel® HT Technology)	No
PCI Express slots version	4.0
Thermal Design Power (TDP)	65 W
Market segment	Desktop
Processor cache type	L3
Features
Thermal Design Power (TDP)	65 W
PCI Express slots version	4.0
Market segment	Desktop
Harmonized System (HS) code	85423119
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)	No
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	4.7 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	105 W
Processor cache	32 MB
Processor model	7600X
Processor threads	12
Processor boost frequency	5.3 GHz
Processor lithography	5 nm
Processor family	AMD Ryzen™ 5
Processor cores	6
Box	No
Processor socket	Socket AM5
Processor cache type	L3
Memory
Memory channels	Dual-channel
Graphics
Discrete graphics card	No
On-board graphics card model	AMD Radeon Graphics
On-board graphics card	Yes
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	105 W
Technical details
Compatible operating systems	Windows 11/10 x64, RHEL, Ubuntu
Thermal Design Power (TDP)	105 W
Market segment	Desktop
Processor cache type	L3
Features
Thermal Design Power (TDP)	105 W
Compatible operating systems	Windows 11/10 x64, RHEL, Ubuntu
Market segment	Desktop

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
ECC	No
Memory clock speed	2600 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	2600 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	77.1 g
Package weight	101.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	101.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.75 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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