Display
HDCP	Yes
Display brightness (typical)	300 cd/m²
Screen shape	Flat
Display number of colours	16.7 million colours
Native aspect ratio	16:9
Pixel density	158 ppi
Colour gamut	72%
Maximum refresh rate	60 Hz
HD type	Full HD
Display technology	LCD
Viewing angle, horizontal	178°
Viewing angle, vertical	178°
Pixel pitch	0.1611 x 0.1611 mm
Viewable size, horizontal	30.9 cm
Viewable size, vertical	17.4 cm
Digital horizontal frequency	30 - 80 kHz
Digital vertical frequency	56 - 61 Hz
Backlight type	LED
Display resolution	1920 x 1080 pixels
Response time	6 ms
Display diagonal	35.6 cm (14")
Contrast ratio (typical)	700:1
Touchscreen	No
Panel type	IPS
RGB colour space	NTSC
Display diagonal (metric)	35.56 cm
Anti-glare screen	Yes
Audio
Built-in speaker(s)	No
Performance
Built-in speaker(s)	No
Built-in camera	No
Management features
On Screen Display (OSD)	Yes
Plug and Play	Yes
Multimedia
Built-in speaker(s)	No
Built-in camera	No
Design
Market positioning	Business
Heavy metals free	Hg (mercury)
Product colour	Grey
Front bezel colour	Black
Camera
Built-in camera	No
Ports & interfaces
Headphone out	No
HDCP	Yes
HDMI	No
USB Power Delivery	Yes
USB Power Delivery up to	65 W
USB Type-C DisplayPort Alternate Mode	Yes
Number of USB Type-C upstream ports quantity	2
HDCP version	1.4
Technical details
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Cable lock slot	No
HDMI	No
Product colour	Grey
Front bezel colour	Black
Sustainability certificates	ENERGY STAR, RoHS
Doesn't contain	PVC/BFR
Power supply type	Internal
Weight (with stand)	590 g
Touchscreen	No
Ergonomics
VESA mounting	No
Cable lock slot	No
LED indicators	Yes
Tilt angle range	10 - 90°
On Screen Display (OSD)	Yes
Plug and Play	Yes
Height adjustment	No
Tilt adjustment	Yes
Power
Power supply type	Internal
Power consumption (max)	7.5 W
Power consumption (standby)	0.3 W
Power consumption (typical)	5 W
Power consumption (off)	0.3 W
Energy efficiency scale	A to G
Energy efficiency class (SDR)	B
Energy efficiency class (HDR)	Not available
Energy consumption (SDR) per 1000 hours	5 kWh
Operational conditions
Non-operating altitude	5000 - 12192 m
Operating temperature (T-T)	0 - 40 °C
Storage temperature (T-T)	-20 - 60 °C
Operating relative humidity (H-H)	10 - 80%
Storage relative humidity (H-H)	5 - 90%
Operating altitude	0 - 5000 m
Weight & dimensions
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Width (with stand)	322.4 mm
Depth (with stand)	14.3 mm
Height (with stand)	202.7 mm
Bezel width (side)	6.53 mm
Bezel width (top)	6.54 mm
Bezel width (bottom)	2.22 cm
Weight (with stand)	590 g
Package weight	1.12 kg
Packaging data
Package weight	1.12 kg
Sustainability
Sustainability certificates	ENERGY STAR, RoHS
Doesn't contain	PVC/BFR
European Product Registry for Energy Labelling (EPREL) code	1435998
Total carbon footprint	421 kg of CO2e
Indication
LED indicators	Yes
Carbon footprint
Total carbon footprint	421 kg of CO2e
Total carbon emissions (w/o Use phase)	374 kg of CO2e
Total carbon emissions (Standard deviation)	99 kg of CO2e
PAIA version	1.3.2
Carbon emissions (Use)	47 kg of CO2e
Carbon emissions (Manufacturing)	368 kg of CO2e
Carbon emissions (Logistics)	6 kg of CO2e
Carbon emissions (End-of-Life)	1 kg of CO2e
Logistics data
Total carbon footprint	421 kg of CO2e
Other features
Height (without stand)	202.7 mm
Depth (without stand)	4.95 mm
Width (without stand)	322.4 mm
Power consumption (max)	7.5 W
HDMI	No
USB Power Delivery up to	65 W
Energy efficiency scale	A to G
USB Type-C DisplayPort Alternate Mode	Yes
Power supply type	Internal
Touchscreen	No
USB Power Delivery	Yes
Front bezel colour	Black

DELL P Series 14 Portable Monitor - P1424H

35.6cm (14") Full HD 1920 x 1080 LED IPS, 16:9, 300cd/m², 16.7M, 6ms, 178°/178°, 700:1

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Availability 228 In stock/63 sold

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SKU : DELL-P1424H
Part Number : 5397184821572
Manufacture : DELL

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7402P
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7402P
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7402
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7402
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.35 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.3 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7352
Processor threads	48
Processor operating modes	32-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119

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Processor
Processor base frequency	2.65 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	165 W
Thermal Design Power (TDP)	180 W
Processor cache	128 MB
Processor model	7413
Processor threads	48
Processor boost frequency	3.6 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP3
Configurable TDP-up	200 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	180 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	180 W
Market segment	Server
Configurable TDP-up	200 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	180 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	200 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.85 GHz
Processor manufacturer	AMD
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	7443P
Processor threads	48
Processor boost frequency	4 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP3
Configurable TDP-up	200 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Power
Configurable TDP-down	165 W
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Configurable TDP-up	200 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	200 W
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.9 GHz
Processor manufacturer	AMD
Thermal Design Power (TDP)	200 W
Processor cache	128 MB
Processor model	9254
Processor threads	48
Processor boost frequency	4.15 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP5
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Dodeca-channel
Memory bandwidth (max)	460.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	200 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	200 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	200 W
PCI Express slots version	5.0
Market segment	Server

Processor
Processor base frequency	4.05 GHz
Processor manufacturer	AMD
Thermal Design Power (TDP)	320 W
Processor cache	256 MB
Processor model	9274F
Processor threads	48
Processor boost frequency	4.3 GHz
Component for	Server/workstation
Processor family	AMD EPYC
Processor cores	24
Processor socket	Socket SP5
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Dodeca-channel
Memory bandwidth (max)	460.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	320 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	320 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	320 W
PCI Express slots version	5.0
Market segment	Server

Processor
Processor base frequency	2.55 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	155 W
Thermal Design Power (TDP)	160 W
Processor cache	64 MB
Processor model	8224P
Processor threads	48
Processor boost frequency	3 GHz
Processor family	AMD EPYC
Processor cores	24
Box	No
Processor socket	Socket SP6
Configurable TDP-up	225 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR5-SDRAM
Memory clock speeds supported by processor	4800 MHz
Memory channels	Hexa-channel
Memory bandwidth (max)	230.4 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	155 W
Thermal Design Power (TDP)	160 W
Technical details
PCI Express slots version	5.0
Thermal Design Power (TDP)	160 W
Market segment	Server
Configurable TDP-up	225 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	96
Thermal Design Power (TDP)	160 W
PCI Express slots version	5.0
Market segment	Server
Processor special features
Configurable TDP-up	225 W

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