Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
Subscribe To Newsletter
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
No Minimum Spend
30 Days Return Policy
Email Support Available
Secured by SSL & 3D V2
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £371.72
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £616.64
| Processor | |
|---|---|
| Processor generation | 11th gen Intel® Core™ i9 |
| Processor base frequency | 3.5 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Configurable TDP-down | 95 W |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 16 MB |
| Processor ARK ID | 212321 |
| Processor model | i9-11900KF |
| Processor threads | 16 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5.3 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i9 |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Configurable TDP-down frequency | 3 GHz |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 50 GB/s |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 95 W |
| Thermal Design Power (TDP) | 125 W |
| Configurable TDP-down frequency | 3 GHz |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | No |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | No |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Configurable TDP-down frequency | 3 GHz |
| Processor cache type | Smart Cache |
| Target market | Gaming, Content Creation |
| Features | |
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 212321 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G167599 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | No |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Intel® Turbo Boost Technology 2.0 frequency | 5.1 GHz |
| Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 | Yes |
| Intel® Thermal Velocity Boost Temperature | 70 °C |
| Intel® Thermal Velocity Boost Frequency | 5.3 GHz |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
| Processor | |
|---|---|
| Processor generation | 11th gen Intel® Core™ i9 |
| Processor base frequency | 3.5 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Configurable TDP-down | 95 W |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 16 MB |
| Processor ARK ID | 212321 |
| Processor model | i9-11900KF |
| Processor threads | 16 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5.3 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i9 |
| Processor cores | 8 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Configurable TDP-down frequency | 3 GHz |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 50 GB/s |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 95 W |
| Thermal Design Power (TDP) | 125 W |
| Configurable TDP-down frequency | 3 GHz |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | No |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | No |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Configurable TDP-down frequency | 3 GHz |
| Processor cache type | Smart Cache |
| Target market | Gaming, Content Creation |
| Features | |
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 212321 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G167599 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | No |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Intel® Turbo Boost Technology 2.0 frequency | 5.1 GHz |
| Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 | Yes |
| Intel® Thermal Velocity Boost Temperature | 70 °C |
| Intel® Thermal Velocity Boost Frequency | 5.3 GHz |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
Save £133.35
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313 |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313 |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £284.87
| Processor | |
|---|---|
| Processor base frequency | 2.65 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 180 W |
| Processor cache | 128 MB |
| Processor model | 7413 |
| Processor threads | 48 |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 24 |
| Box | No |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 180 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 180 W |
| Market segment | Server |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 180 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 200 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 2.65 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 180 W |
| Processor cache | 128 MB |
| Processor model | 7413 |
| Processor threads | 48 |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 24 |
| Box | No |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 165 W |
| Thermal Design Power (TDP) | 180 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 180 W |
| Market segment | Server |
| Configurable TDP-up | 200 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 180 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Configurable TDP-up | 200 W |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £502.37
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 235 W |
| Processor cache | 42 MB |
| Processor ARK ID | 212456 |
| Processor model | 6348 |
| Processor threads | 56 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 28 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 12 |
| High priority core frequency | 2.8 GHz |
| Low priority cores | 16 |
| Low priority core frequency | 2.5 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 235 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 235 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 235 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212456 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 80 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 235 W |
| Processor cache | 42 MB |
| Processor ARK ID | 212456 |
| Processor model | 6348 |
| Processor threads | 56 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 28 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 12 |
| High priority core frequency | 2.8 GHz |
| Low priority cores | 16 |
| Low priority core frequency | 2.5 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 235 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 235 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 235 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212456 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 80 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £712.50
| Processor | |
|---|---|
| Processor generation | 11th gen Intel® Core™ i5 |
| Processor base frequency | 2.7 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 12 MB |
| Processor ARK ID | 212277 |
| Processor model | i5-11500 |
| Processor threads | 12 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i5 |
| Processor cores | 6 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 50 GB/s |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card maximum resolution (DisplayPort) | 5120 x 3200 pixels |
| Number of execution units | 32 |
| On-board graphics card ID | 0x4C8A |
| On-board graphics card 4K support | Yes |
| On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 5120 x 3200 pixels |
| On-board graphics card refresh rate at maximum resolution (HDMI) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
| Maximum on-board graphics card memory | 64 GB |
| Number of displays supported (on-board graphics) | 3 |
| On-board graphics card maximum resolution (HDMI) | 4096 x 2160 pixels |
| On-board graphics card OpenGL version | 4.5 |
| On-board graphics card model | Intel UHD Graphics 750 |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1300 MHz |
| On-board graphics card base frequency | 350 MHz |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 65 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Target market | Gaming |
| Features | |
| On-board graphics card ID | 0x4C8A |
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 212277 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G167599 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Clear Video Technology | Yes |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Turbo Boost Technology 2.0 frequency | 4.6 GHz |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 | Yes |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
| Processor | |
|---|---|
| Processor generation | 11th gen Intel® Core™ i5 |
| Processor base frequency | 2.7 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 12 MB |
| Processor ARK ID | 212277 |
| Processor model | i5-11500 |
| Processor threads | 12 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i5 |
| Processor cores | 6 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 50 GB/s |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card maximum resolution (DisplayPort) | 5120 x 3200 pixels |
| Number of execution units | 32 |
| On-board graphics card ID | 0x4C8A |
| On-board graphics card 4K support | Yes |
| On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 5120 x 3200 pixels |
| On-board graphics card refresh rate at maximum resolution (HDMI) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
| Maximum on-board graphics card memory | 64 GB |
| Number of displays supported (on-board graphics) | 3 |
| On-board graphics card maximum resolution (HDMI) | 4096 x 2160 pixels |
| On-board graphics card OpenGL version | 4.5 |
| On-board graphics card model | Intel UHD Graphics 750 |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1300 MHz |
| On-board graphics card base frequency | 350 MHz |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 65 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Target market | Gaming |
| Features | |
| On-board graphics card ID | 0x4C8A |
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 212277 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G167599 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Clear Video Technology | Yes |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Turbo Boost Technology 2.0 frequency | 4.6 GHz |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 | Yes |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
Save £79.41
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor ARK ID | 212460 |
| Processor model | 6354 |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 8 |
| High priority core frequency | 3.1 GHz |
| Low priority cores | 10 |
| Low priority core frequency | 2.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212460 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor ARK ID | 212460 |
| Processor model | 6354 |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 8 |
| High priority core frequency | 3.1 GHz |
| Low priority cores | 10 |
| Low priority core frequency | 2.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212460 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £1,154.92
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 42 MB |
| Processor ARK ID | 212458 |
| Processor model | 6330 |
| Processor threads | 56 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.1 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 28 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 12 |
| High priority core frequency | 2.1 GHz |
| Low priority cores | 16 |
| Low priority core frequency | 1.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212458 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 86 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 42 MB |
| Processor ARK ID | 212458 |
| Processor model | 6330 |
| Processor threads | 56 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.1 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 28 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 12 |
| High priority core frequency | 2.1 GHz |
| Low priority cores | 16 |
| Low priority core frequency | 1.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212458 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 86 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £999.61
| Processor | |
|---|---|
| Processor generation | 11th gen Intel® Core™ i5 |
| Processor base frequency | 2.8 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 12 MB |
| Processor ARK ID | 212274 |
| Processor model | i5-11600 |
| Processor threads | 12 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.8 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i5 |
| Processor cores | 6 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 50 GB/s |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card maximum resolution (DisplayPort) | 5120 x 3200 pixels |
| Number of execution units | 32 |
| On-board graphics card ID | 0x4C8A |
| On-board graphics card 4K support | Yes |
| On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 5120 x 3200 pixels |
| On-board graphics card refresh rate at maximum resolution (HDMI) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
| Maximum on-board graphics card memory | 64 GB |
| Number of displays supported (on-board graphics) | 3 |
| On-board graphics card maximum resolution (HDMI) | 4096 x 2160 pixels |
| On-board graphics card OpenGL version | 4.5 |
| On-board graphics card model | Intel UHD Graphics 750 |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1300 MHz |
| On-board graphics card base frequency | 350 MHz |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 65 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Target market | Gaming |
| Features | |
| On-board graphics card ID | 0x4C8A |
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 212274 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G167599 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Clear Video Technology | Yes |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Turbo Boost Technology 2.0 frequency | 4.8 GHz |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 | Yes |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
| Processor | |
|---|---|
| Processor generation | 11th gen Intel® Core™ i5 |
| Processor base frequency | 2.8 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Thermal Design Power (TDP) | 65 W |
| Processor cache | 12 MB |
| Processor ARK ID | 212274 |
| Processor model | i5-11600 |
| Processor threads | 12 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.8 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i5 |
| Processor cores | 6 |
| Box | No |
| Processor socket | LGA 1200 (Socket H5) |
| Processor cache type | Smart Cache |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory bandwidth supported by processor (max) | 50 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Dual-channel |
| Memory bandwidth (max) | 50 GB/s |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card maximum resolution (DisplayPort) | 5120 x 3200 pixels |
| Number of execution units | 32 |
| On-board graphics card ID | 0x4C8A |
| On-board graphics card 4K support | Yes |
| On-board graphics card maximum resolution (eDP - Integrated Flat Panel) | 5120 x 3200 pixels |
| On-board graphics card refresh rate at maximum resolution (HDMI) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (DisplayPort) | 60 Hz |
| On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) | 60 Hz |
| Maximum on-board graphics card memory | 64 GB |
| Number of displays supported (on-board graphics) | 3 |
| On-board graphics card maximum resolution (HDMI) | 4096 x 2160 pixels |
| On-board graphics card OpenGL version | 4.5 |
| On-board graphics card model | Intel UHD Graphics 750 |
| On-board graphics card | Yes |
| On-board graphics card dynamic frequency (max) | 1300 MHz |
| On-board graphics card base frequency | 350 MHz |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 65 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q1'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Target market | Gaming |
| Features | |
| On-board graphics card ID | 0x4C8A |
| Maximum number of PCI Express lanes | 20 |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 212274 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| PCI Express configurations | 1x16+1x4, 2x8+1x4, 1x8+3x4 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G167599 |
| Use conditions | PC/Client/Tablet |
| Processor special features | |
| Intel Clear Video Technology | Yes |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Optane™ Memory Ready | Yes |
| Intel® OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Quick Sync Video Technology | Yes |
| Intel® InTru™ 3D Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® Boot Guard | Yes |
| Intel® Thermal Velocity Boost | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Turbo Boost Technology 2.0 frequency | 4.8 GHz |
| Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 | Yes |
| Operational conditions | |
| Tjunction | 100 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| Maximum internal memory | 128 GB |
| CPU configuration (max) | 1 |
Save £66.15
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 36 MB |
| Processor ARK ID | 212457 |
| Processor model | 6346 |
| Processor threads | 32 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 4 |
| High priority core frequency | 3.2 GHz |
| Low priority cores | 12 |
| Low priority core frequency | 3 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212457 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 78 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 36 MB |
| Processor ARK ID | 212457 |
| Processor model | 6346 |
| Processor threads | 32 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 4 |
| High priority core frequency | 3.2 GHz |
| Low priority cores | 12 |
| Low priority core frequency | 3 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212457 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 78 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £996.90
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 48 MB |
| Processor ARK ID | 212285 |
| Processor model | 6338 |
| Processor threads | 64 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 32 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 12 |
| High priority core frequency | 2.2 GHz |
| Low priority cores | 20 |
| Low priority core frequency | 1.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212285 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 81 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 48 MB |
| Processor ARK ID | 212285 |
| Processor model | 6338 |
| Processor threads | 64 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® |
| Processor cores | 32 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 12 |
| High priority core frequency | 2.2 GHz |
| Low priority cores | 20 |
| Low priority core frequency | 1.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212285 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 81 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £1,349.23
| Display | |
|---|---|
| HDCP | Yes |
| Display brightness (typical) | 300 cd/m² |
| Screen shape | Flat |
| Display number of colours | 16.7 million colours |
| Native aspect ratio | 16:9 |
| Pixel density | 158 ppi |
| Colour gamut | 72% |
| Maximum refresh rate | 60 Hz |
| HD type | Full HD |
| Display technology | LCD |
| Viewing angle, horizontal | 178° |
| Viewing angle, vertical | 178° |
| Pixel pitch | 0.1611 x 0.1611 mm |
| Viewable size, horizontal | 30.9 cm |
| Viewable size, vertical | 17.4 cm |
| Digital horizontal frequency | 30 - 80 kHz |
| Digital vertical frequency | 56 - 61 Hz |
| Backlight type | LED |
| Display resolution | 1920 x 1080 pixels |
| Response time | 6 ms |
| Display diagonal | 35.6 cm (14") |
| Contrast ratio (typical) | 700:1 |
| Touchscreen | No |
| Panel type | IPS |
| RGB colour space | NTSC |
| Display diagonal (metric) | 35.56 cm |
| Anti-glare screen | Yes |
| Audio | |
| Built-in speaker(s) | No |
| Performance | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Management features | |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Multimedia | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Design | |
| Market positioning | Business |
| Heavy metals free | Hg (mercury) |
| Product colour | Grey |
| Front bezel colour | Black |
| Camera | |
| Built-in camera | No |
| Ports & interfaces | |
| Headphone out | No |
| HDCP | Yes |
| HDMI | No |
| USB Power Delivery | Yes |
| USB Power Delivery up to | 65 W |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Number of USB Type-C upstream ports quantity | 2 |
| HDCP version | 1.4 |
| Technical details | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Cable lock slot | No |
| HDMI | No |
| Product colour | Grey |
| Front bezel colour | Black |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| Power supply type | Internal |
| Weight (with stand) | 590 g |
| Touchscreen | No |
| Ergonomics | |
| VESA mounting | No |
| Cable lock slot | No |
| LED indicators | Yes |
| Tilt angle range | 10 - 90° |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Height adjustment | No |
| Tilt adjustment | Yes |
| Power | |
| Power supply type | Internal |
| Power consumption (max) | 7.5 W |
| Power consumption (standby) | 0.3 W |
| Power consumption (typical) | 5 W |
| Power consumption (off) | 0.3 W |
| Energy efficiency scale | A to G |
| Energy efficiency class (SDR) | B |
| Energy efficiency class (HDR) | Not available |
| Energy consumption (SDR) per 1000 hours | 5 kWh |
| Operational conditions | |
| Non-operating altitude | 5000 - 12192 m |
| Operating temperature (T-T) | 0 - 40 °C |
| Storage temperature (T-T) | -20 - 60 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Storage relative humidity (H-H) | 5 - 90% |
| Operating altitude | 0 - 5000 m |
| Weight & dimensions | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Width (with stand) | 322.4 mm |
| Depth (with stand) | 14.3 mm |
| Height (with stand) | 202.7 mm |
| Bezel width (side) | 6.53 mm |
| Bezel width (top) | 6.54 mm |
| Bezel width (bottom) | 2.22 cm |
| Weight (with stand) | 590 g |
| Package weight | 1.12 kg |
| Packaging data | |
| Package weight | 1.12 kg |
| Sustainability | |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| European Product Registry for Energy Labelling (EPREL) code | 1435998 |
| Total carbon footprint | 421 kg of CO2e |
| Indication | |
| LED indicators | Yes |
| Carbon footprint | |
| Total carbon footprint | 421 kg of CO2e |
| Total carbon emissions (w/o Use phase) | 374 kg of CO2e |
| Total carbon emissions (Standard deviation) | 99 kg of CO2e |
| PAIA version | 1.3.2 |
| Carbon emissions (Use) | 47 kg of CO2e |
| Carbon emissions (Manufacturing) | 368 kg of CO2e |
| Carbon emissions (Logistics) | 6 kg of CO2e |
| Carbon emissions (End-of-Life) | 1 kg of CO2e |
| Logistics data | |
| Total carbon footprint | 421 kg of CO2e |
| Other features | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Power consumption (max) | 7.5 W |
| HDMI | No |
| USB Power Delivery up to | 65 W |
| Energy efficiency scale | A to G |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Power supply type | Internal |
| Touchscreen | No |
| USB Power Delivery | Yes |
| Front bezel colour | Black |
Save £23.67
