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Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 135 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 135 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
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