Processor
Processor base frequency	3 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	155 W
Processor cache	128 MB
Processor model	7302
Processor threads	32
Processor operating modes	32-bit
Processor boost frequency	3.3 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	16
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	155 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	155 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	155 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	2.8 GHz
Processor manufacturer	AMD
Cooler included	No
Thermal Design Power (TDP)	120 W
Processor cache	64 MB
Processor model	7282
Processor threads	32
Processor operating modes	32-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	7 nm
Processor family	AMD EPYC
Processor cores	16
Box	No
Processor socket	Socket SP3
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	85.3 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	120 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	120 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	120 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor base frequency	3.05 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	225 W
Thermal Design Power (TDP)	240 W
Processor cache	768 MB
Processor model	7373X
Processor threads	32
Processor boost frequency	3.8 GHz
Processor family	AMD EPYC
Processor cores	16
Box	No
Processor socket	Socket SP3
Configurable TDP-up	280 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	225 W
Thermal Design Power (TDP)	240 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	240 W
Market segment	Server
Configurable TDP-up	280 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	240 W
PCI Express slots version	4.0
Market segment	Server
Harmonized System (HS) code	85423119
Processor special features
Configurable TDP-up	280 W

Processor
Processor base frequency	2.4 GHz
Processor manufacturer	AMD
Cooler included	No
Configurable TDP-down	120 W
Thermal Design Power (TDP)	130 W
Processor cache	64 MB
Processor model	7303P
Processor threads	32
Processor boost frequency	3.4 GHz
Processor family	AMD EPYC
Processor cores	16
Box	No
Processor socket	Socket SP3
Configurable TDP-up	150 W
Processor cache type	L3
Memory
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	3200 MHz
Memory channels	Octa-channel
Memory bandwidth (max)	204.8 GB/s
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Configurable TDP-down	120 W
Thermal Design Power (TDP)	130 W
Technical details
PCI Express slots version	4.0
Thermal Design Power (TDP)	130 W
Market segment	Server
Configurable TDP-up	150 W
Processor cache type	L3
Features
Maximum number of PCI Express lanes	128
Thermal Design Power (TDP)	130 W
PCI Express slots version	4.0
Market segment	Server
Processor special features
Configurable TDP-up	150 W

Processors

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