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| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 192443 |
| Processor model | 6240 |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 192443 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 85 °C |
| Packaging data | |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Other features | |
| Maximum internal memory | 1 TB |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 192443 |
| Processor model | 6240 |
| Processor threads | 36 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 2933 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| Processor package size | 76mm x 56.5mm |
| Processor ARK ID | 192443 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 4S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Optane™ DC Persistent Memory technology | Yes |
| Intel Speed Select Technology (SST) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 85 °C |
| Packaging data | |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76mm x 56.5mm |
| Package width | 43 mm |
| Package depth | 137 mm |
| Package height | 112 mm |
| Package weight | 201 g |
| Other features | |
| Maximum internal memory | 1 TB |
Save £480.32
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Memory bandwidth supported by processor (max) | 93.85 GB/s |
| Thermal Design Power (TDP) | 165 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 198011 |
| Processor model | W-2295 |
| Processor threads | 36 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon W |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 2066 (Socket R4) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory bandwidth supported by processor (max) | 93.85 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 165 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Physical Address Extension (PAE) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 165 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Physical Address Extension (PAE) | 46 bit |
| Market segment | Workstation |
| Launch date | Q4'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 165 W |
| Processor package size | 45mm x 52.5mm |
| Processor ARK ID | 198011 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Physical Address Extension (PAE) | 46 bit |
| Market segment | Workstation |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Memory Protection Extensions (Intel® MPX) | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel® OS Guard | Yes |
| Intel TSX-NI | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.8 GHz |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 61 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 45mm x 52.5mm |
| Other features | |
| Maximum internal memory | 1 TB |
| CPU configuration (max) | 1 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Memory bandwidth supported by processor (max) | 93.85 GB/s |
| Thermal Design Power (TDP) | 165 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 198011 |
| Processor model | W-2295 |
| Processor threads | 36 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon W |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 2066 (Socket R4) |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory bandwidth supported by processor (max) | 93.85 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 165 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Physical Address Extension (PAE) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 165 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Physical Address Extension (PAE) | 46 bit |
| Market segment | Workstation |
| Launch date | Q4'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 165 W |
| Processor package size | 45mm x 52.5mm |
| Processor ARK ID | 198011 |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Physical Address Extension (PAE) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Physical Address Extension (PAE) | 46 bit |
| Market segment | Workstation |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Memory Protection Extensions (Intel® MPX) | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel® OS Guard | Yes |
| Intel TSX-NI | Yes |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.8 GHz |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 61 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 45mm x 52.5mm |
| Other features | |
| Maximum internal memory | 1 TB |
| CPU configuration (max) | 1 |
Save £1,024.44
| Processor | |
|---|---|
| Processor generation | 10th gen Intel® Core™ i9 |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Memory bandwidth supported by processor (max) | 94 GB/s |
| Thermal Design Power (TDP) | 165 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 198017 |
| Processor model | i9-10980XE |
| Processor threads | 36 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i9 X-series Extreme Edition |
| Processor cores | 18 |
| Box | Yes |
| Processor socket | LGA 2066 (Socket R4) |
| Processor cache type | Smart Cache |
| Generation | 10th Generation |
| Memory | |
| Maximum internal memory supported by processor | 256 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory bandwidth supported by processor (max) | 94 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Quad-channel |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 165 W |
| Technical details | |
| Thermal solution specification | PCG 2017X |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 165 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q4'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Maximum memory | 256 GB |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s DMI3 |
| Target market | Gaming |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 165 W |
| Processor ARK ID | 198017 |
| Thermal solution specification | PCG 2017X |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.8 GHz |
| Operational conditions | |
| Tjunction | 86 °C |
| Packaging data | |
| Package width | 138 mm |
| Package depth | 138 mm |
| Package height | 61 mm |
| Package weight | 490 g |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Package width | 138 mm |
| Package depth | 138 mm |
| Package height | 61 mm |
| Package weight | 490 g |
| Other features | |
| Maximum internal memory | 256 GB |
| CPU configuration (max) | 1 |
| Processor | |
|---|---|
| Processor generation | 10th gen Intel® Core™ i9 |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Memory bandwidth supported by processor (max) | 94 GB/s |
| Thermal Design Power (TDP) | 165 W |
| Processor cache | 24.75 MB |
| Processor ARK ID | 198017 |
| Processor model | i9-10980XE |
| Processor threads | 36 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.6 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Core™ i9 X-series Extreme Edition |
| Processor cores | 18 |
| Box | Yes |
| Processor socket | LGA 2066 (Socket R4) |
| Processor cache type | Smart Cache |
| Generation | 10th Generation |
| Memory | |
| Maximum internal memory supported by processor | 256 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory bandwidth supported by processor (max) | 94 GB/s |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Quad-channel |
| ECC | No |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 165 W |
| Technical details | |
| Thermal solution specification | PCG 2017X |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 165 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Desktop |
| Launch date | Q4'19 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Maximum memory | 256 GB |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Bus speed | 8 GT/s DMI3 |
| Target market | Gaming |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 165 W |
| Processor ARK ID | 198017 |
| Thermal solution specification | PCG 2017X |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G077159 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® Turbo Boost Max Technology 3.0 frequency | 4.8 GHz |
| Operational conditions | |
| Tjunction | 86 °C |
| Packaging data | |
| Package width | 138 mm |
| Package depth | 138 mm |
| Package height | 61 mm |
| Package weight | 490 g |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Package width | 138 mm |
| Package depth | 138 mm |
| Package height | 61 mm |
| Package weight | 490 g |
| Other features | |
| Maximum internal memory | 256 GB |
| CPU configuration (max) | 1 |
Save £607.32
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor ARK ID | 212460 |
| Processor model | 6354 |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 8 |
| High priority core frequency | 3.1 GHz |
| Low priority cores | 10 |
| Low priority core frequency | 2.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212460 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 39 MB |
| Processor ARK ID | 212460 |
| Processor model | 6354 |
| Processor threads | 36 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 18 |
| Box | No |
| Processor socket | LGA 4189 |
| High priority cores | 8 |
| High priority core frequency | 3.1 GHz |
| Low priority cores | 10 |
| Low priority core frequency | 2.8 GHz |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | Cloud Computing |
| Servicing status | Baseline Servicing |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 205 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212460 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 64 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 77 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £850.21
