| Processor |
|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 270 W |
| Processor cache | 57 MB |
| Processor ARK ID | 212455 |
| Processor model | 8368 |
| Processor threads | 76 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 38 |
| Box | No |
| Processor socket | LGA 4189 |
| Processor series | Intel Xeon Platinum 8000 Series |
| High priority cores | 16 |
| High priority core frequency | 2.5 GHz |
| Low priority cores | 22 |
| Low priority core frequency | 2.3 GHz |
| Memory |
|---|
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics |
|---|
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power |
|---|
| Thermal Design Power (TDP) | 270 W |
| Technical details |
|---|
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 270 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Processor series | Intel Xeon Platinum 8000 Series |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 3200 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Target market | High Performance Computing |
| Servicing status | Baseline Servicing |
| Features |
|---|
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 270 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 212455 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features |
|---|
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 512 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions |
|---|
| Tcase | 84 °C |
| Logistics data |
|---|
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions |
|---|
| Processor package size | 77.5 x 56.5 mm |
| Other features |
|---|
| Maximum internal memory | 6 TB |
