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Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 35.75 MB |
Processor model | 5220R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £1,238.45
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor model | 6248R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1024 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 205 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 205 W |
Processor cache | 35.75 MB |
Processor model | 6248R |
Processor threads | 48 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 24 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1024 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 205 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 205 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 205 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Save £2,366.17
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £363.27
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 16.5 MB |
Processor model | 4214R |
Processor threads | 24 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 12 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 16.5 MB |
Processor model | 4214R |
Processor threads | 24 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 12 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £592.61
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 135 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 3rd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Thermal Design Power (TDP) | 135 W |
Processor cache | 24 MB |
Processor model | 4314 |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.4 GHz |
Component for | Server/workstation |
Processor lithography | 10 nm |
Processor family | Intel Xeon Silver |
Processor cores | 16 |
Box | No |
Processor socket | LGA 4189 |
Memory | |
Maximum internal memory supported by processor | 6.14 TB |
Memory clock speeds supported by processor | 2667 MHz |
Memory channels | Octa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 135 W |
Technical details | |
PCI Express slots version | 4.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 135 W |
Market segment | Server |
Features | |
Maximum number of PCI Express lanes | 64 |
Thermal Design Power (TDP) | 135 W |
PCI Express slots version | 4.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £378.33
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £326.84
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 130 W |
Processor cache | 11 MB |
Processor model | 4215R |
Processor threads | 16 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 130 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 130 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 130 W |
Processor cache | 11 MB |
Processor model | 4215R |
Processor threads | 16 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 130 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 130 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £468.06
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 130 W |
Processor cache | 11 MB |
Processor model | 4215R |
Processor threads | 16 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 130 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 130 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 3.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 130 W |
Processor cache | 11 MB |
Processor model | 4215R |
Processor threads | 16 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 130 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 130 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Save £491.46
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.5 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 85 W |
Processor cache | 11 MB |
Processor model | 4215 |
Processor threads | 16 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 85 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 85 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 85 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.5 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 85 W |
Processor cache | 11 MB |
Processor model | 4215 |
Processor threads | 16 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 8 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 85 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 85 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 85 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Save £682.51
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 22 MB |
Processor model | 6226R |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.9 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.9 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 22 MB |
Processor model | 6226R |
Processor threads | 32 |
System bus rate | 10.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.9 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £1,013.55
Processor | |
---|---|
Processor generation | 3rd gen Intel® Core™ i3 |
Processor base frequency | 2.8 GHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Thermal Design Power (TDP) | 35 W |
Processor cache | 3 MB |
Processor model | i3-3220T |
Processor threads | 4 |
System bus rate | 5 GT/s |
Processor operating modes | 64-bit |
Stepping | L1 |
Processor lithography | 22 nm |
Processor family | Intel® Core™ i3 |
Processor cores | 2 |
Box | No |
Processor socket | LGA 1155 (Socket H2) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1333,1600 MHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Memory channels | Dual-channel |
ECC | Yes |
Graphics | |
Number of displays supported (on-board graphics) | 3 |
On-board graphics card model | Intel® HD Graphics 2500 |
On-board graphics card | Yes |
On-board graphics card dynamic frequency (max) | 1050 MHz |
On-board graphics card base frequency | 650 MHz |
Power | |
Thermal Design Power (TDP) | 35 W |
Technical details | |
Thermal solution specification | PCG 2011A |
Intel® Secure Key | No |
Thermal Monitoring Technologies | Yes |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Smart Cache | Yes |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Thermal Design Power (TDP) | 35 W |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 35 W |
Thermal solution specification | PCG 2011A |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Embedded options available | No |
Processor special features | |
Intel® Secure Key | No |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Smart Cache | Yes |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | No |
Operational conditions | |
Tcase | 65 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Processor | |
---|---|
Processor generation | 3rd gen Intel® Core™ i3 |
Processor base frequency | 2.8 GHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Thermal Design Power (TDP) | 35 W |
Processor cache | 3 MB |
Processor model | i3-3220T |
Processor threads | 4 |
System bus rate | 5 GT/s |
Processor operating modes | 64-bit |
Stepping | L1 |
Processor lithography | 22 nm |
Processor family | Intel® Core™ i3 |
Processor cores | 2 |
Box | No |
Processor socket | LGA 1155 (Socket H2) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1333,1600 MHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Memory channels | Dual-channel |
ECC | Yes |
Graphics | |
Number of displays supported (on-board graphics) | 3 |
On-board graphics card model | Intel® HD Graphics 2500 |
On-board graphics card | Yes |
On-board graphics card dynamic frequency (max) | 1050 MHz |
On-board graphics card base frequency | 650 MHz |
Power | |
Thermal Design Power (TDP) | 35 W |
Technical details | |
Thermal solution specification | PCG 2011A |
Intel® Secure Key | No |
Thermal Monitoring Technologies | Yes |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Smart Cache | Yes |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
Thermal Design Power (TDP) | 35 W |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 35 W |
Thermal solution specification | PCG 2011A |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Embedded options available | No |
Processor special features | |
Intel® Secure Key | No |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Smart Cache | Yes |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | No |
Operational conditions | |
Tcase | 65 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Save £189.81
Processor | |
---|---|
Processor generation | 3rd gen Intel® Core™ i3 |
Processor base frequency | 3.3 GHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Thermal Design Power (TDP) | 55 W |
Processor cache | 3 MB |
Processor model | i3-3220 |
Processor threads | 4 |
System bus rate | 5 GT/s |
Processor operating modes | 64-bit |
Stepping | L1 |
Processor lithography | 22 nm |
Processor family | Intel® Core™ i3 |
Processor cores | 2 |
Box | No |
Processor socket | LGA 1155 (Socket H2) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1333,1600 MHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Memory channels | Dual-channel |
ECC | Yes |
Graphics | |
Number of displays supported (on-board graphics) | 3 |
On-board graphics card model | Intel® HD Graphics 2500 |
On-board graphics card | Yes |
On-board graphics card dynamic frequency (max) | 1050 MHz |
On-board graphics card base frequency | 650 MHz |
Power | |
Thermal Design Power (TDP) | 55 W |
Technical details | |
Thermal solution specification | PCG 2011C |
Intel® Secure Key | No |
Thermal Monitoring Technologies | Yes |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Thermal Design Power (TDP) | 55 W |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 55 W |
Thermal solution specification | PCG 2011C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Embedded options available | Yes |
Processor special features | |
Intel® Secure Key | No |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | No |
Operational conditions | |
Tcase | 65.3 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Processor | |
---|---|
Processor generation | 3rd gen Intel® Core™ i3 |
Processor base frequency | 3.3 GHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Thermal Design Power (TDP) | 55 W |
Processor cache | 3 MB |
Processor model | i3-3220 |
Processor threads | 4 |
System bus rate | 5 GT/s |
Processor operating modes | 64-bit |
Stepping | L1 |
Processor lithography | 22 nm |
Processor family | Intel® Core™ i3 |
Processor cores | 2 |
Box | No |
Processor socket | LGA 1155 (Socket H2) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 32 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 1333,1600 MHz |
Memory bandwidth supported by processor (max) | 25.6 GB/s |
Memory channels | Dual-channel |
ECC | Yes |
Graphics | |
Number of displays supported (on-board graphics) | 3 |
On-board graphics card model | Intel® HD Graphics 2500 |
On-board graphics card | Yes |
On-board graphics card dynamic frequency (max) | 1050 MHz |
On-board graphics card base frequency | 650 MHz |
Power | |
Thermal Design Power (TDP) | 55 W |
Technical details | |
Thermal solution specification | PCG 2011C |
Intel® Secure Key | No |
Thermal Monitoring Technologies | Yes |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Thermal Design Power (TDP) | 55 W |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Thermal Design Power (TDP) | 55 W |
Thermal solution specification | PCG 2011C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 2.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | AVX, SSE4.1, SSE4.2 |
Embedded options available | Yes |
Processor special features | |
Intel® Secure Key | No |
Intel® Wireless Display (Intel® WiDi) | Yes |
Intel® Turbo Boost Technology | No |
Intel Trusted Execution Technology | No |
Intel® Quick Sync Video Technology | Yes |
Intel® My WiFi Technology (Intel® MWT) | Yes |
Intel® InTru™ 3D Technology | Yes |
Intel® Insider™ | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel FDI Technology | Yes |
Intel® Clear Video HD Technology (Intel® CVT HD) | Yes |
Intel® Anti-Theft Technology (Intel® AT) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | No |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | No |
Operational conditions | |
Tcase | 65.3 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-x |
Save £217.52
Save £45.28