Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	100 W
Processor cache	13.75 MB
Processor model	4210R
Processor threads	20
System bus rate	9.6 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	10
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	100 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	100 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	100 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	100 W
Processor cache	13.75 MB
Processor model	4210R
Processor threads	20
System bus rate	9.6 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	10
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	100 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	100 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	100 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	100 W
Processor cache	13.75 MB
Processor model	4210R
Processor threads	20
System bus rate	9.6 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	10
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	100 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	100 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	100 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	100 W
Processor cache	13.75 MB
Processor model	4210R
Processor threads	20
System bus rate	9.6 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	10
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	100 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	100 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	100 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processor
Processor generation	2nd Generation Intel® Xeon® Scalable
Processor base frequency	2.4 GHz
Processor manufacturer	Intel
Cooler included	No
Processor codename	Cascade Lake
Thermal Design Power (TDP)	100 W
Processor cache	13.75 MB
Processor model	4210R
Processor threads	20
System bus rate	9.6 GT/s
Processor operating modes	64-bit
Processor boost frequency	3.2 GHz
Component for	Server/workstation
Processor lithography	14 nm
Processor family	Intel Xeon Silver
Processor cores	10
Box	No
Processor socket	LGA 3647 (Socket P)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	1.02 TB
Memory types supported by processor	DDR4-SDRAM
Memory clock speeds supported by processor	2400 MHz
Memory channels	Hexa-channel
ECC	Yes
Graphics
Discrete graphics card	No
On-board graphics card model	Not available
On-board graphics card	No
Discrete graphics card model	Not available
Power
Thermal Design Power (TDP)	100 W
Technical details
PCI Express slots version	3.0
Scalability	2S
Thermal Design Power (TDP)	100 W
Market segment	Server
Processor cache type	L3
Features
Maximum number of PCI Express lanes	48
Thermal Design Power (TDP)	100 W
PCI Express slots version	3.0
Scalability	2S
Market segment	Server
Harmonized System (HS) code	85423119
Logistics data
Harmonized System (HS) code	85423119

Processors

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