Get 5% Off Your Order When You Leave us a 5 Star Review, Let us Know Your Experience Here
Subscribe To Newsletter
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
Subscribe to the Porto mailing list to receive updates on new arrivals, special offers and our promotions.
No Minimum Spend
30 Days Return Policy
Email Support Available
Secured by SSL & 3D V2
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 5220R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 5220R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £1,151.24
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor model | 6248R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor model | 6248R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
Save £2,209.66
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £557.58
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £432.45
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Thermal Design Power (TDP) | 135 W |
| Processor cache | 24 MB |
| Processor model | 4314 |
| Processor threads | 32 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 135 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 135 W |
| Market segment | Server |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 135 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Thermal Design Power (TDP) | 135 W |
| Processor cache | 24 MB |
| Processor model | 4314 |
| Processor threads | 32 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 135 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 135 W |
| Market segment | Server |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 135 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £500.39
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £413.18
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Processor model | 7313 |
| Processor threads | 128 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Technical details | |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Processor model | 7313 |
| Processor threads | 128 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.7 GHz |
| Component for | Server/workstation |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Box | No |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Technical details | |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
Save £611.66
| Processor | |
|---|---|
| Processor generation | Intel Xeon Scalable 4th Gen |
| Processor base frequency | 2.5 GHz |
| Processor manufacturer | Intel |
| Processor codename | Sapphire Rapids |
| Thermal Design Power (TDP) | 185 W |
| Processor cache | 37.5 MB |
| Processor ARK ID | 232377 |
| Processor model | 6426Y |
| Processor threads | 32 |
| System bus rate | 16 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Stepping | S3 |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4677 (Socket E) |
| High priority cores | 4 |
| High priority core frequency | 2.7 GHz |
| Low priority cores | 12 |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 185 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 185 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'23 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 4800 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E1B |
| Features | |
| Maximum number of PCI Express lanes | 80 |
| Thermal Design Power (TDP) | 185 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 232377 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G180729 |
| Use conditions | Server/Enterprise |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® OS Guard | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Maximum Enclave Size Support for Intel® SGX | 128 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® On Demand Feature Activation | Yes |
| Intel® Data Streaming Accelerator (DSA) | 1 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Operational conditions | |
| Tcase | 80 °C |
| DTS Max | 95 °C |
| Logistics data | |
| Harmonized System (HS) code | 8542310001 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 4 TB |
| Processor | |
|---|---|
| Processor generation | Intel Xeon Scalable 4th Gen |
| Processor base frequency | 2.5 GHz |
| Processor manufacturer | Intel |
| Processor codename | Sapphire Rapids |
| Thermal Design Power (TDP) | 185 W |
| Processor cache | 37.5 MB |
| Processor ARK ID | 232377 |
| Processor model | 6426Y |
| Processor threads | 32 |
| System bus rate | 16 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4.1 GHz |
| Stepping | S3 |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4677 (Socket E) |
| High priority cores | 4 |
| High priority core frequency | 2.7 GHz |
| Low priority cores | 12 |
| Memory | |
| Maximum internal memory supported by processor | 6 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 185 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 185 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q1'23 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 3 |
| Memory speed (max) | 4800 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E1B |
| Features | |
| Maximum number of PCI Express lanes | 80 |
| Thermal Design Power (TDP) | 185 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 232377 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 8542310001 |
| Export Control Classification Number (ECCN) | 5A992C |
| Commodity Classification Automated Tracking System (CCATS) | G180729 |
| Use conditions | Server/Enterprise |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® OS Guard | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Maximum Enclave Size Support for Intel® SGX | 128 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® On Demand Feature Activation | Yes |
| Intel® Data Streaming Accelerator (DSA) | 1 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Operational conditions | |
| Tcase | 80 °C |
| DTS Max | 95 °C |
| Logistics data | |
| Harmonized System (HS) code | 8542310001 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 4 TB |
Save £581.35
