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| Processor | |
|---|---|
| Processor base frequency | 1.6 GHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 15 MB |
| Processor model | E5-2603V3 |
| Processor threads | 6 |
| System bus rate | 6.4 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.30 V |
| Number of QPI links | 2 |
| Bus type | QPI |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor family | Intel Xeon E5 v3 |
| Processor cores | 6 |
| Processor socket | LGA 2011-v3 |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600 MHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| VID Voltage Range | 0.65 - 1.30 V |
| Technical details | |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 85 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 40 |
| Thermal Design Power (TDP) | 85 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® OS Guard | Yes |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 72.8 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Compatibility | HP ML350 |
| Processor | |
|---|---|
| Processor base frequency | 1.6 GHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 15 MB |
| Processor model | E5-2603V3 |
| Processor threads | 6 |
| System bus rate | 6.4 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.30 V |
| Number of QPI links | 2 |
| Bus type | QPI |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor family | Intel Xeon E5 v3 |
| Processor cores | 6 |
| Processor socket | LGA 2011-v3 |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600 MHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| VID Voltage Range | 0.65 - 1.30 V |
| Technical details | |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 85 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 40 |
| Thermal Design Power (TDP) | 85 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® OS Guard | Yes |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 72.8 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Compatibility | HP ML350 |
Save £138.74
| Processor | |
|---|---|
| Processor clock speed | 2.13 GHz |
| Component for | Server/Workstation |
| Weight & dimensions | |
| Weight | 1.36 kg |
| Other features | |
| Size | 16.84 cm (6.63") |
| Dimensions (WxDxH) | 168.4 x 165.1 x 177.8 mm |
| Processor | |
|---|---|
| Processor clock speed | 2.13 GHz |
| Component for | Server/Workstation |
| Weight & dimensions | |
| Weight | 1.36 kg |
| Other features | |
| Size | 16.84 cm (6.63") |
| Dimensions (WxDxH) | 168.4 x 165.1 x 177.8 mm |
Save £94.61
| Processor | |
|---|---|
| Processor base frequency | 1.6 GHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 15 MB |
| Processor model | E5-2603V3 |
| Processor threads | 6 |
| System bus rate | 6.4 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.30 V |
| Number of QPI links | 2 |
| Bus type | QPI |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor family | Intel Xeon E5 v3 |
| Processor cores | 6 |
| Processor socket | LGA 2011-v3 |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600 MHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| VID Voltage Range | 0.65 - 1.30 V |
| Technical details | |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 85 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 40 |
| Thermal Design Power (TDP) | 85 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® OS Guard | Yes |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 72.8 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Compatibility | HP DL380 |
| Processor | |
|---|---|
| Processor base frequency | 1.6 GHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 15 MB |
| Processor model | E5-2603V3 |
| Processor threads | 6 |
| System bus rate | 6.4 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.30 V |
| Number of QPI links | 2 |
| Bus type | QPI |
| Component for | Server/workstation |
| Processor lithography | 22 nm |
| Processor family | Intel Xeon E5 v3 |
| Processor cores | 6 |
| Processor socket | LGA 2011-v3 |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 768 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 1600 MHz |
| Memory bandwidth supported by processor (max) | 51 GB/s |
| Memory channels | Quad-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| VID Voltage Range | 0.65 - 1.30 V |
| Technical details | |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 85 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 40 |
| Thermal Design Power (TDP) | 85 W |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX 2.0 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® OS Guard | Yes |
| Intel TSX-NI | No |
| Intel® Secure Key | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Identity Protection Technology (Intel® IPT) | No |
| Intel Flex Memory Access | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 72.8 °C |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Compatibility | HP DL380 |
Save £170.30
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 11 MB |
| Processor model | 4208 |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Stepping | R1 |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Silver 4000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1000 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 85 W |
| Processor series | Intel Xeon Silver 4000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Number of UPI links | 2 |
| Mode-based Execute Control (MBE) version | Yes |
| Intel® Volume Management Device (VMD) version | Yes |
| Intel® Run Sure Technology version | No |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 85 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Intel® Optane™ Memory module included | No |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 78 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Other features | |
| Compatibility | DL360 Gen10 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 85 W |
| Processor cache | 11 MB |
| Processor model | 4208 |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Stepping | R1 |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Silver 4000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1000 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 85 W |
| Technical details | |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 85 W |
| Processor series | Intel Xeon Silver 4000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Number of UPI links | 2 |
| Mode-based Execute Control (MBE) version | Yes |
| Intel® Volume Management Device (VMD) version | Yes |
| Intel® Run Sure Technology version | No |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 85 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX-512 |
| Scalability | 2S |
| Embedded options available | No |
| Market segment | Server |
| Intel® Optane™ Memory module included | No |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 1 |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 78 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Other features | |
| Compatibility | DL360 Gen10 |
Save £366.26
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 5220R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.2 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 5220R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £1,186.12
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor model | 6248R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 35.75 MB |
| Processor model | 6248R |
| Processor threads | 48 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 24 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1024 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 205 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 205 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
Save £2,120.08
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 13.75 MB |
| Processor model | 4210R |
| Processor threads | 20 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.2 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 10 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £532.23
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 100 W |
| Processor cache | 16.5 MB |
| Processor model | 4214R |
| Processor threads | 24 |
| System bus rate | 9.6 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.5 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | No |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1.02 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2400 MHz |
| Memory channels | Hexa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 100 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 100 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 100 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £528.55
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 120 W |
| Processor cache | 18 MB |
| Processor ARK ID | 215277 |
| Processor model | 4310 |
| Processor threads | 24 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | Yes |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 120 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 120 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2667 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 120 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 215277 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 8 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 82 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 120 W |
| Processor cache | 18 MB |
| Processor ARK ID | 215277 |
| Processor model | 4310 |
| Processor threads | 24 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.3 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 12 |
| Box | Yes |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Supported memory types | DDR4-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 120 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 120 W |
| Supported memory types | DDR4-SDRAM |
| Status | Launched |
| Market segment | Server |
| Launch date | Q2'21 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| Memory speed (max) | 2667 MHz |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 120 W |
| Processor package size | 77.5 x 56.5 mm |
| Processor ARK ID | 215277 |
| Execute Disable Bit | Yes |
| PCI Express slots version | 4.0 |
| Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Export Control Classification Number (ECCN) | 5A992CN3 |
| Commodity Classification Automated Tracking System (CCATS) | G178966 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Optane™ DC Persistent Memory Supported | No |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Maximum Enclave Size Support for Intel® SGX | 8 GB |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Operational conditions | |
| Tcase | 82 °C |
| Packaging data | |
| Package type | Retail box |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 6 TB |
Save £329.02
| Processor | |
|---|---|
| Processor base frequency | 2.8 GHz |
| Processor manufacturer | Intel |
| Processor model | 4309Y |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Processor socket | LGA 4189 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| PCI Express slots version | 4.0 |
| Features | |
| PCI Express slots version | 4.0 |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel® Turbo Boost Technology | 2.0 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Width | 775 mm |
| Depth | 565 mm |
| Processor | |
|---|---|
| Processor base frequency | 2.8 GHz |
| Processor manufacturer | Intel |
| Processor model | 4309Y |
| Processor threads | 16 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.6 GHz |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 8 |
| Processor socket | LGA 4189 |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| PCI Express slots version | 4.0 |
| Features | |
| PCI Express slots version | 4.0 |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel® Turbo Boost Technology | 2.0 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Width | 775 mm |
| Depth | 565 mm |
Save £384.79
| Processor | |
|---|---|
| Processor base frequency | 2.53 GHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Thermal Design Power (TDP) | 80 W |
| Processor cache | 12 MB |
| Processor model | E5630 |
| Processor threads | 8 |
| System bus rate | 5.86 GT/s |
| Processor operating modes | 64-bit |
| L1 cache | 0.256 MB |
| VID Voltage Range | 0.75 - 1.35 V |
| Processor boost frequency | 2.8 GHz |
| Number of QPI links | 2 |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Processor family | Intel® Xeon® 5000 Sequence |
| Processor cores | 4 |
| Processor socket | Socket B (LGA 1366) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 288 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800,1066 MHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Memory channels | Triple-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 80 W |
| VID Voltage Range | 0.75 - 1.35 V |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Supported instruction sets | SSE4.2 |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 80 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 80 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Supported instruction sets | SSE4.2 |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 77.6 °C |
| Weight & dimensions | |
| Width | 152.4 mm |
| Weight | 1.59 kg |
| Height | 171.4 mm |
| Depth | 155.7 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| L1 cache | 0.256 MB |
| Processor | |
|---|---|
| Processor base frequency | 2.53 GHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Thermal Design Power (TDP) | 80 W |
| Processor cache | 12 MB |
| Processor model | E5630 |
| Processor threads | 8 |
| System bus rate | 5.86 GT/s |
| Processor operating modes | 64-bit |
| L1 cache | 0.256 MB |
| VID Voltage Range | 0.75 - 1.35 V |
| Processor boost frequency | 2.8 GHz |
| Number of QPI links | 2 |
| Component for | Server/workstation |
| Processor lithography | 32 nm |
| Processor family | Intel® Xeon® 5000 Sequence |
| Processor cores | 4 |
| Processor socket | Socket B (LGA 1366) |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 288 GB |
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800,1066 MHz |
| Memory bandwidth supported by processor (max) | 25.6 GB/s |
| Memory channels | Triple-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 80 W |
| VID Voltage Range | 0.75 - 1.35 V |
| Technical details | |
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Supported instruction sets | SSE4.2 |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 80 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Thermal Design Power (TDP) | 80 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Supported instruction sets | SSE4.2 |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Operational conditions | |
| Tcase | 77.6 °C |
| Weight & dimensions | |
| Width | 152.4 mm |
| Weight | 1.59 kg |
| Height | 171.4 mm |
| Depth | 155.7 mm |
| Other features | |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| L1 cache | 0.256 MB |
Save £25.36
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Thermal Design Power (TDP) | 135 W |
| Processor cache | 24 MB |
| Processor model | 4314 |
| Processor threads | 32 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 135 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 135 W |
| Market segment | Server |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 135 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.4 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Thermal Design Power (TDP) | 135 W |
| Processor cache | 24 MB |
| Processor model | 4314 |
| Processor threads | 32 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Component for | Server/workstation |
| Processor lithography | 10 nm |
| Processor family | Intel Xeon Silver |
| Processor cores | 16 |
| Box | No |
| Processor socket | LGA 4189 |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory clock speeds supported by processor | 2667 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 135 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 135 W |
| Market segment | Server |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 135 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
Save £367.94
| Display | |
|---|---|
| HDCP | Yes |
| Display brightness (typical) | 300 cd/m² |
| Screen shape | Flat |
| Display number of colours | 16.7 million colours |
| Native aspect ratio | 16:9 |
| Pixel density | 158 ppi |
| Colour gamut | 72% |
| Maximum refresh rate | 60 Hz |
| HD type | Full HD |
| Display technology | LCD |
| Viewing angle, horizontal | 178° |
| Viewing angle, vertical | 178° |
| Pixel pitch | 0.1611 x 0.1611 mm |
| Viewable size, horizontal | 30.9 cm |
| Viewable size, vertical | 17.4 cm |
| Digital horizontal frequency | 30 - 80 kHz |
| Digital vertical frequency | 56 - 61 Hz |
| Backlight type | LED |
| Display resolution | 1920 x 1080 pixels |
| Response time | 6 ms |
| Display diagonal | 35.6 cm (14") |
| Contrast ratio (typical) | 700:1 |
| Touchscreen | No |
| Panel type | IPS |
| RGB colour space | NTSC |
| Display diagonal (metric) | 35.56 cm |
| Anti-glare screen | Yes |
| Audio | |
| Built-in speaker(s) | No |
| Performance | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Management features | |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Multimedia | |
| Built-in speaker(s) | No |
| Built-in camera | No |
| Design | |
| Market positioning | Business |
| Heavy metals free | Hg (mercury) |
| Product colour | Grey |
| Front bezel colour | Black |
| Camera | |
| Built-in camera | No |
| Ports & interfaces | |
| Headphone out | No |
| HDCP | Yes |
| HDMI | No |
| USB Power Delivery | Yes |
| USB Power Delivery up to | 65 W |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Number of USB Type-C upstream ports quantity | 2 |
| HDCP version | 1.4 |
| Technical details | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Cable lock slot | No |
| HDMI | No |
| Product colour | Grey |
| Front bezel colour | Black |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| Power supply type | Internal |
| Weight (with stand) | 590 g |
| Touchscreen | No |
| Ergonomics | |
| VESA mounting | No |
| Cable lock slot | No |
| LED indicators | Yes |
| Tilt angle range | 10 - 90° |
| On Screen Display (OSD) | Yes |
| Plug and Play | Yes |
| Height adjustment | No |
| Tilt adjustment | Yes |
| Power | |
| Power supply type | Internal |
| Power consumption (max) | 7.5 W |
| Power consumption (standby) | 0.3 W |
| Power consumption (typical) | 5 W |
| Power consumption (off) | 0.3 W |
| Energy efficiency scale | A to G |
| Energy efficiency class (SDR) | B |
| Energy efficiency class (HDR) | Not available |
| Energy consumption (SDR) per 1000 hours | 5 kWh |
| Operational conditions | |
| Non-operating altitude | 5000 - 12192 m |
| Operating temperature (T-T) | 0 - 40 °C |
| Storage temperature (T-T) | -20 - 60 °C |
| Operating relative humidity (H-H) | 10 - 80% |
| Storage relative humidity (H-H) | 5 - 90% |
| Operating altitude | 0 - 5000 m |
| Weight & dimensions | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Width (with stand) | 322.4 mm |
| Depth (with stand) | 14.3 mm |
| Height (with stand) | 202.7 mm |
| Bezel width (side) | 6.53 mm |
| Bezel width (top) | 6.54 mm |
| Bezel width (bottom) | 2.22 cm |
| Weight (with stand) | 590 g |
| Package weight | 1.12 kg |
| Packaging data | |
| Package weight | 1.12 kg |
| Sustainability | |
| Sustainability certificates | ENERGY STAR, RoHS |
| Doesn't contain | PVC/BFR |
| European Product Registry for Energy Labelling (EPREL) code | 1435998 |
| Total carbon footprint | 421 kg of CO2e |
| Indication | |
| LED indicators | Yes |
| Carbon footprint | |
| Total carbon footprint | 421 kg of CO2e |
| Total carbon emissions (w/o Use phase) | 374 kg of CO2e |
| Total carbon emissions (Standard deviation) | 99 kg of CO2e |
| PAIA version | 1.3.2 |
| Carbon emissions (Use) | 47 kg of CO2e |
| Carbon emissions (Manufacturing) | 368 kg of CO2e |
| Carbon emissions (Logistics) | 6 kg of CO2e |
| Carbon emissions (End-of-Life) | 1 kg of CO2e |
| Logistics data | |
| Total carbon footprint | 421 kg of CO2e |
| Other features | |
| Height (without stand) | 202.7 mm |
| Depth (without stand) | 4.95 mm |
| Width (without stand) | 322.4 mm |
| Power consumption (max) | 7.5 W |
| HDMI | No |
| USB Power Delivery up to | 65 W |
| Energy efficiency scale | A to G |
| USB Type-C DisplayPort Alternate Mode | Yes |
| Power supply type | Internal |
| Touchscreen | No |
| USB Power Delivery | Yes |
| Front bezel colour | Black |
Save £23.67
