Processor
Processor base frequency	2.13 GHz
Thermal Design Power (TDP)	105 W
Processor cache	24 MB
Processor model	E7-2830
Processor threads	16
System bus rate	6.4 GT/s
Processor operating modes	64-bit
Processor boost frequency	2.4 GHz
Stepping	A2
CPU multiplier (bus/core ratio)	16
Component for	Server/workstation
Processor lithography	32 nm
Processor family	Intel® Xeon® E7 Family
Processor cores	8
Box	No
Processor socket	LGA 1567 (Socket LS)
Processor cache type	L3
Power
Thermal Design Power (TDP)	105 W
Features
Thermal Design Power (TDP)	105 W
Market segment	Server
Operational conditions
Maximum operating temperature	64 °C
Technical details
Thermal Design Power (TDP)	105 W
Market segment	Server
Processor cache type	L3

Processor
Processor base frequency	2.5 GHz
Memory bandwidth supported by processor (max)	42.6 GB/s
Thermal Design Power (TDP)	95 W
Processor cache	15 MB
Processor model	E5-2640
Processor threads	12
System bus rate	7.20 GT/s
Processor operating modes	64-bit
VID Voltage Range	0.6 - 1.35 V
Processor boost frequency	3 GHz
CPU multiplier (bus/core ratio)	30
Component for	Server/workstation
Processor lithography	32 nm
Processor family	Intel® Xeon® E5 Family
Processor cores	6
Box	No
Processor socket	LGA 2011 (Socket R)
Processor cache type	L3
Memory
Maximum internal memory supported by processor	750 GB
Memory clock speeds supported by processor	800,1066,1333 MHz
Memory bandwidth supported by processor (max)	42.6 GB/s
Memory channels	Quad-channel
ECC	Yes
Power
Thermal Design Power (TDP)	95 W
VID Voltage Range	0.6 - 1.35 V
Features
Thermal Design Power (TDP)	95 W
Market segment	Server
Harmonized System (HS) code	85423119
Operational conditions
Maximum operating temperature	77.4 °C
Technical details
Thermal Design Power (TDP)	95 W
Market segment	Server
Processor cache type	L3
Logistics data
Harmonized System (HS) code	85423119

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
ECC	No
Memory clock speed	2600 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	2600 MHz
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	77.1 g
Package weight	101.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	101.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.75 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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